| 10905008 |
Wiring board |
Takahiro Hayashi |
2021-01-26 |
| 9237656 |
Method of manufacturing multi-layer wiring board |
Shinnosuke MAEDA, Tetsuo Suzuki, Atsuhiko Sugimoto, Satoshi Hirano, Hajime Saiki |
2016-01-12 |
| 9119333 |
Multilayer wiring board |
Masahiro Inoue, Hajime Saiki, Atsuhiko Sugimoto, Hidetoshi Wada |
2015-08-25 |
| 8866025 |
Multilayer wiring board |
Masahiro Inoue, Hajime Saiki, Atsuhiko Sugimoto, Hidetoshi Wada |
2014-10-21 |
| 8707554 |
Method of manufacturing multilayer wiring substrate |
Shinnosuke MAEDA, Tetsuo Suzuki, Tatsuya Ito, Satoshi Hirano, Atsuhiko Sugimoto |
2014-04-29 |
| 8581388 |
Multilayered wiring substrate |
Shinnosuke MAEDA, Tetsuo Suzuki, Atsuhiko Sugimoto, Tatsuya Ito, Satoshi Hirano |
2013-11-12 |
| 8233289 |
Multilayer wiring substrate and method for manufacturing the same |
Shinnosuke MAEDA, Toshiya Asano |
2012-07-31 |
| 8143534 |
Wiring board having solder bump and method for manufacturing the same |
Hajime Saiki, Kazutaka Tanaka |
2012-03-27 |
| 6391422 |
Wiring substrate and stiffener therefor |
Seiji Mori |
2002-05-21 |
