Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9237656 | Method of manufacturing multi-layer wiring board | Shinnosuke MAEDA, Tetsuo Suzuki, Takuya HANDO, Atsuhiko Sugimoto, Satoshi Hirano | 2016-01-12 |
| 9132494 | Wiring board and method for manufacturing the same | Masahiro Inoue, Atsuhiko Sugimoto | 2015-09-15 |
| 9119333 | Multilayer wiring board | Takuya HANDO, Masahiro Inoue, Atsuhiko Sugimoto, Hidetoshi Wada | 2015-08-25 |
| 9006580 | Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate | Shinnosuke MAEDA, Satoshi Hirano | 2015-04-14 |
| 8937256 | Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic component | Masahiro Inoue, Atsuhiko Sugimoto | 2015-01-20 |
| 8866025 | Multilayer wiring board | Masahiro Inoue, Atsuhiko Sugimoto, Takuya HANDO, Hidetoshi Wada | 2014-10-21 |
| 8322596 | Wiring substrate manufacturing method | Takahiro Hayashi, Satoru Watanabe, Koji Sakuma | 2012-12-04 |
| 8319111 | Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers | Mikiya Sakurai, Atsuhiko Sugimoto | 2012-11-27 |
| 8143534 | Wiring board having solder bump and method for manufacturing the same | Takuya HANDO, Kazutaka Tanaka | 2012-03-27 |
| 7808799 | Wiring board | Tadahiko Kawabe, Masao Kuroda, Yasuhiro Sugimoto, Shinji Yuri, Makoto Origuchi | 2010-10-05 |
| 7704548 | Method for manufacturing wiring board | Tadahiko Kawabe, Masao Kuroda, Yasuhiro Sugimoto, Shinji Yuri, Makoto Origuchi | 2010-04-27 |
| 7692103 | Wiring substrate and manufacturing process of the same | Mikiya Sakurai | 2010-04-06 |
| 7488896 | Wiring board with semiconductor component | Masahiro Iba | 2009-02-10 |
| 7420131 | Wiring substrate | Michitoshi Nakata | 2008-09-02 |
| 7317165 | Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate | Kazuhiro Urashima | 2008-01-08 |
| 7291791 | Resin substrate | Motohiko Itai | 2007-11-06 |
| 7202156 | Process for manufacturing a wiring substrate | Atsuhiko Sugimoto, Mikiya Sakurai | 2007-04-10 |
| 7164085 | Multilayer wiring board including stacked via structure | — | 2007-01-16 |
| 7122894 | Wiring substrate and process for manufacturing the same | Atsuhiko Sugimoto | 2006-10-17 |
| 6978714 | Solder paste printing method, solder paste printing apparatus, and method for manufacturing a wiring substrate having solder- printed layers | Michitoshi Nakata | 2005-12-27 |
| 6960729 | Upright-pin-joined resin substrate, method of producing the substrate, pins, and method of producing the pins | Noritaka Miyamoto | 2005-11-01 |
| 6660946 | Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin | Noritaka Miyamoto | 2003-12-09 |
| 6648211 | Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin | Noritaka Miyamoto | 2003-11-18 |
| 6583366 | Substrate having pins | — | 2003-06-24 |
| 6555757 | Pin solder jointed to a resin substrate, made having a predetermined hardness and dimensions | Noritaka Miyamoto | 2003-04-29 |