Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10470300 | Glass panel for wiring board and method of manufacturing wiring board | Toshitake Seki, Yutaka Takagi, Toshikazu Horio | 2019-11-05 |
| 9237656 | Method of manufacturing multi-layer wiring board | Shinnosuke MAEDA, Tetsuo Suzuki, Takuya HANDO, Satoshi Hirano, Hajime Saiki | 2016-01-12 |
| 9132494 | Wiring board and method for manufacturing the same | Masahiro Inoue, Hajime Saiki | 2015-09-15 |
| 9119333 | Multilayer wiring board | Takuya HANDO, Masahiro Inoue, Hajime Saiki, Hidetoshi Wada | 2015-08-25 |
| 9059152 | Wiring substrate and manufacturing method of the same | Masahiro Inoue | 2015-06-16 |
| 8937256 | Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic component | Masahiro Inoue, Hajime Saiki | 2015-01-20 |
| 8866025 | Multilayer wiring board | Masahiro Inoue, Hajime Saiki, Takuya HANDO, Hidetoshi Wada | 2014-10-21 |
| 8707554 | Method of manufacturing multilayer wiring substrate | Shinnosuke MAEDA, Tetsuo Suzuki, Takuya HANDO, Tatsuya Ito, Satoshi Hirano | 2014-04-29 |
| 8581388 | Multilayered wiring substrate | Shinnosuke MAEDA, Tetsuo Suzuki, Tatsuya Ito, Takuya HANDO, Satoshi Hirano | 2013-11-12 |
| 8319111 | Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers | Hajime Saiki, Mikiya Sakurai | 2012-11-27 |
| 7202156 | Process for manufacturing a wiring substrate | Hajime Saiki, Mikiya Sakurai | 2007-04-10 |
| 7122894 | Wiring substrate and process for manufacturing the same | Hajime Saiki | 2006-10-17 |