Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7420131 | Wiring substrate | Hajime Saiki | 2008-09-02 |
| 6978714 | Solder paste printing method, solder paste printing apparatus, and method for manufacturing a wiring substrate having solder- printed layers | Hajime Saiki | 2005-12-27 |