Issued Patents All Time
Showing 101–125 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9105681 | Method for forming deep silicon via for grounding of circuits and devices, emitter ballasting and isolation | Volker Blaschke, Todd Thibeault, Chris Cureton, Paul D. Hurwitz, Arjun Kar-Roy +1 more | 2015-08-11 |
| 9098610 | Communication for implantable medical devices | Richard J. Polefko, Scott G. Leyh, Steven E. Wilder | 2015-08-04 |
| 9064886 | Heterojunction bipolar transistor having a germanium extrinsic base utilizing a sacrificial emitter post | Edward Preisler, George Talor, Gerson R. Ortuno | 2015-06-23 |
| 8598713 | Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation | Volker Blaschke, Todd Thibeault, Chris Cureton, Paul D. Hurwitz, Arjun Kar-Roy +1 more | 2013-12-03 |
| 8513063 | Method for encapsulating microelectronic devices | Michael J. DeBar, Daniel M. So | 2013-08-20 |
| 8212351 | Structure for encapsulating microelectronic devices | Michael J. DeBar, Daniel M. So | 2012-07-03 |
| 8212331 | Method for fabricating a backside through-wafer via in a processed wafer and related structure | Arjun Kar-Roy, Marco Racanelli | 2012-07-03 |
| 8110861 | MIM capacitor high-k dielectric for increased capacitance density | Hadi Abdul-Ridha | 2012-02-07 |
| 7897484 | Fabricating a top conductive layer in a semiconductor die | Arjun Kar-Roy, Marco Racanelli | 2011-03-01 |
| 7772673 | Deep trench isolation and method for forming same | Kevin Q. Yin, Amol Kalburge, Arjun Kar-Roy, Dieter Dornisch | 2010-08-10 |
| 7719041 | MIM capacitor high-k dielectric for increased capacitance density | Hadi Abdul-Ridha | 2010-05-18 |
| 7709949 | Densely packed metal segments patterned in a semiconductor die | Tinghao Wang, Dieter Dornisch, Julia Wu, Hadi Abdul-Ridha | 2010-05-04 |
| 7704874 | Method for fabricating a frontside through-wafer via in a processed wafer and related structure | Arjun Kar-Roy, Marco Racanelli | 2010-04-27 |
| 7589009 | Method for fabricating a top conductive layer in a semiconductor die and related structure | Arjun Kar-Roy, Marco Racanelli | 2009-09-15 |
| 7268038 | Method for fabricating a MIM capacitor having increased capacitance density and related structure | Dieter Dornisch, Kenneth M. Ring, Tinghao Wang, Guangming Li | 2007-09-11 |
| 7235861 | NPN transistor having reduced extrinsic base resistance and improved manufacturability | Marco Racanelli, Greg D. U'Ren | 2007-06-26 |
| 7220639 | Method for fabricating a MIM capacitor high-K dielectric for increased capacitance density and related structure | Hadi Abdul-Ridha | 2007-05-22 |
| 7173318 | On-chip inductors | Q Z Liu, Bin Zhao | 2007-02-06 |
| 7093247 | Installation of a data processing solution | Lindsey Louise Ashworth, Helen Postlethwaite, Graham Derek Wallis | 2006-08-15 |
| 7064361 | NPN transistor having reduced extrinsic base resistance and improved manufacturability | Marco Racanelli, Greg D. U'Ren | 2006-06-20 |
| 7041569 | Method for fabricating a high density composite MIM capacitor with reduced voltage dependence in semiconductor dies | Arjun Kar-Roy, Marco Racanelli | 2006-05-09 |
| 6943414 | Method for fabricating a metal resistor in an IC chip and related structure | Arjun Kar Roy, Q.Z. Liu | 2005-09-13 |
| 6919272 | Method for patterning densely packed metal segments in a semiconductor die and related structure | Tinghao Wang, Dieter Dornisch, Julia Wu, Hadi Abdul-Ridha | 2005-07-19 |
| 6893931 | Reducing extrinsic base resistance in an NPN transistor | Marco Racanelli, Greg D. U'Ren | 2005-05-17 |
| 6885056 | High-k dielectric stack in a MIM capacitor and method for its fabrication | Dieter Dornisch, Abhijit Bhaskar Joshi | 2005-04-26 |