Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9105681 | Method for forming deep silicon via for grounding of circuits and devices, emitter ballasting and isolation | Volker Blaschke, Todd Thibeault, Paul D. Hurwitz, Arjun Kar-Roy, David J. Howard +1 more | 2015-08-11 |
| 8598713 | Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation | Volker Blaschke, Todd Thibeault, Paul D. Hurwitz, Arjun Kar-Roy, David J. Howard +1 more | 2013-12-03 |