Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297591 | BiCMOS integration using a shared SiGe layer | Edward Preisler | 2019-05-21 |
| 10290630 | BiCMOS integration with reduced masking steps | Edward Preisler | 2019-05-14 |
| 9673191 | Efficient fabrication of BiCMOS devices | Edward Preisler | 2017-06-06 |
| 9640528 | Low-cost complementary BiCMOS integration scheme | Edward Preisler | 2017-05-02 |
| 9105681 | Method for forming deep silicon via for grounding of circuits and devices, emitter ballasting and isolation | Volker Blaschke, Chris Cureton, Paul D. Hurwitz, Arjun Kar-Roy, David J. Howard +1 more | 2015-08-11 |
| 8598713 | Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation | Volker Blaschke, Chris Cureton, Paul D. Hurwitz, Arjun Kar-Roy, David J. Howard +1 more | 2013-12-03 |
| 7968418 | Apparatus and method for isolating integrated circuit components using deep trench isolation and shallow trench isolation | Andre P. Labonte | 2011-06-28 |
| 7678657 | System and method for manufacturing an emitter structure in a complementary bipolar CMOS transistor manufacturing process | Steven J. Adler, Scott Ruby | 2010-03-16 |
| 7247544 | High Q inductor integration | Sergei Drizlikh, Thomas Francis | 2007-07-24 |
| 7229908 | System and method for manufacturing an out of plane integrated circuit inductor | Sergei Drizlikh | 2007-06-12 |
| 5290718 | Simplified high reliability gate oxide process | Paul A. Fearon | 1994-03-01 |