Issued Patents All Time
Showing 76–100 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10243523 | Ultra-broadband transimpedance amplifiers (tia) for optical fiber communications | Payam Heydari, Seyed Mohammad Hossein Mohammadnezhad, Alireza Karimi Bidhendi, Michael Green, Edward Preisler | 2019-03-26 |
| 10192805 | Thermally conductive and electrically isolating layers in semiconductor structures | — | 2019-01-29 |
| 10095909 | Hybrid MEMs-floating gate device | Yakov Roizin, Rassul Karabalin | 2018-10-09 |
| 10062644 | Copper interconnect for improving radio frequency (RF) silicon-on-insulator (SOI) switch field effect transistor (FET) stacks | Paul D. Hurwitz | 2018-08-28 |
| 10062636 | Integration of thermally conductive but electrically isolating layers with semiconductor devices | — | 2018-08-28 |
| 9984888 | Method of fabricating a semiconductor wafer including a through substrate via (TSV) and a stepped support ring on a back side of the wafer | Hadi Jebory | 2018-05-29 |
| 9984269 | Fingerprint sensor with direct recording to non-volatile memory | Yakov Roizin, Rassul Karabalin | 2018-05-29 |
| 9966301 | Reduced substrate effects in monolithically integrated RF circuits | Michael J. DeBar, Paul D. Hurwitz | 2018-05-08 |
| 9917104 | Hybrid MOS-PCM CMOS SOI switch | Yakov Roizin, Paul D. Hurwitz | 2018-03-13 |
| 9887123 | Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method | Arjun Kar-Roy | 2018-02-06 |
| 9782587 | Digital control for pulse generators | Stephen C. Trier, Jeffrey A. Weisgarber, Richard J. Polefko | 2017-10-10 |
| 9755063 | RF SOI switches including low dielectric constant features between metal line structures | Rassul Karabalin, Michael J. DeBar | 2017-09-05 |
| 9751753 | Integration of active devices with passive components and MEMS devices | Michael J. DeBar, Jeff Rose | 2017-09-05 |
| 9725306 | MEMS device with sealed cavity and method for fabricating same | Michael J. DeBar | 2017-08-08 |
| 9673081 | Isolated through silicon via and isolated deep silicon via having total or partial isolation | Hadi Jebory, Marco Racanelli, Edward Preisler | 2017-06-06 |
| 9481568 | Integration of active devices with passive components and MEMS devices | Michael J. DeBar, Jeff Rose | 2016-11-01 |
| 9458011 | Scalable self-supported MEMS structure and related method | Michael J. DeBar, Jeff Rose, Arjun Kar-Roy | 2016-10-04 |
| 9436092 | Semiconductor fabrication utilizing grating and trim masks | George Talor, Edward Preisler | 2016-09-06 |
| 9377350 | Light sensor with chemically resistant and robust reflector stack | Jeff Rose, Arjun Kar-Roy, Michael J. DeBar | 2016-06-28 |
| 9346669 | Robust MEMS structure with via cap and related method | Michael J. DeBar, Jeff Rose, Arjun Kar-Roy | 2016-05-24 |
| 9272901 | MEMS device with sealed cavity and release chamber and related double release method | Michael J. DeBar | 2016-03-01 |
| 9245826 | Anchor vias for improved backside metal adhesion to semiconductor substrate | Hadi Jebory, Scott B. Stetson | 2016-01-26 |
| 9209264 | Heterojunction bipolar transistor having a germanium raised extrinsic base | Edward Preisler, George Talor, Gerson R. Ortuno | 2015-12-08 |
| 9154219 | Communication for implantable medical devices | Richard J. Polefko, Scott G. Leyh, Steven E. Wilder | 2015-10-06 |
| 9147609 | Through silicon via structure, method of formation, and integration in semiconductor substrate | Hadi Jebory | 2015-09-29 |