Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984888 | Method of fabricating a semiconductor wafer including a through substrate via (TSV) and a stepped support ring on a back side of the wafer | David J. Howard | 2018-05-29 |
| 9673081 | Isolated through silicon via and isolated deep silicon via having total or partial isolation | David J. Howard, Marco Racanelli, Edward Preisler | 2017-06-06 |
| 9577035 | Isolated through silicon vias in RF technologies | Paul D. Hurwitz, Edward Preisler | 2017-02-21 |
| 9245826 | Anchor vias for improved backside metal adhesion to semiconductor substrate | David J. Howard, Scott B. Stetson | 2016-01-26 |
| 9147609 | Through silicon via structure, method of formation, and integration in semiconductor substrate | David J. Howard | 2015-09-29 |