Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410243 | Segmented actuarial modeling | Judah Rabinowitz, John Henrik Rogers, Ivy Jiangxia Dong | 2022-08-09 |
| 7709949 | Densely packed metal segments patterned in a semiconductor die | Tinghao Wang, Dieter Dornisch, Hadi Abdul-Ridha, David J. Howard | 2010-05-04 |
| 6919272 | Method for patterning densely packed metal segments in a semiconductor die and related structure | Tinghao Wang, Dieter Dornisch, Hadi Abdul-Ridha, David J. Howard | 2005-07-19 |