Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7135385 | Semiconductor devices having a back surface protective coating | Viraj A. Patwardhan, Lian Hee Tan | 2006-11-14 |
| 7095116 | Aluminum-free under bump metallization structure | Viraj A. Patwardhan, King Tong Lim, A. Tharumalingam Sri Ganesh | 2006-08-22 |
| 7045035 | Post singulation die separation apparatus and method for bulk feeding operation | Ken Pham, Jaime A. Bayan, Cheol Han | 2006-05-16 |
| 7015064 | Marking wafers using pigmentation in a mounting tape | Viraj A. Patwardhan | 2006-03-21 |
| 6972244 | Marking semiconductor devices through a mount tape | Viraj A. Patwardhan, You Chye How, Tian Oon Goh, Soi Chong Low | 2005-12-06 |
| RE38789 | Semiconductor wafer having a bottom surface protective coating | Pai-Hsiang Kao, William Jeffrey Schaefer | 2005-09-06 |
| 6932136 | Post singulation die separation apparatus and method for bulk feeding operation | Ken Pham, Jaime A. Bayan, Cheol Han | 2005-08-23 |
| 6916688 | Apparatus and method for a wafer level chip scale package heat sink | Jaime A. Bayan | 2005-07-12 |
| 6900110 | Chip scale package with compliant leads | Hem Takiar | 2005-05-31 |
| 6900532 | Wafer level chip scale package | Hem Takiar | 2005-05-31 |
| 6822315 | Apparatus and method for scribing semiconductor wafers using vision recognition | Luu Thanh Nguyen | 2004-11-23 |
| 6803648 | Integrated circuit packages with interconnects on top and bottom surfaces | Neeraj Pendse | 2004-10-12 |
| 6730170 | Encapsulant material applicator for semiconductor wafers and method of use thereof | Ken Pham, Vivek Kishorechand Arora | 2004-05-04 |
| 6566762 | Front side coating for bump devices | Mark H. Baker | 2003-05-20 |
| 6521970 | Chip scale package with compliant leads | Hem Takiar | 2003-02-18 |
| 6468892 | Front side coating for bump devices | Mark H. Baker | 2002-10-22 |
| 6462426 | Barrier pad for wafer level chip scale packages | Stephen Gee | 2002-10-08 |
| 6459143 | Method of packaging fuses | Inderjit Singh, Hem Takiar, Ranjan J. Mathew | 2002-10-01 |
| 6448632 | Metal coated markings on integrated circuit devices | Hem Takiar, Ken Pham | 2002-09-10 |
| 6398034 | Universal tape for integrated circuits | Hem Takiar | 2002-06-04 |
| 6327158 | Metal pads for electrical probe testing on wafer with bump interconnects | Pai-Hsiang Kao | 2001-12-04 |
| 6255141 | Method of packaging fuses | Inderjit Singh, Hem Takiar, Ranjan J. Mathew | 2001-07-03 |
| 6249044 | Opaque metallization to cover flip chip die surface for light sensitive semiconductor devices | Pai-Hsiang Kao | 2001-06-19 |
| 6175162 | Semiconductor wafer having a bottom surface protective coating | Pai-Hsiang Kao, William Jeffrey Schaefer | 2001-01-16 |
| 6084308 | Chip-on-chip integrated circuit package and method for making the same | William Jeffrey Schaefer, John Jackson | 2000-07-04 |