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Materials and structure for a high reliability BGA connection between LTCC and PB boards |
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2007-10-30 |
| RE38789 |
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2005-09-06 |
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Materials and structure for a high reliability bga connection between LTCC and PB boards |
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2004-10-05 |
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Thermally enhanced flip chip packaging arrangement |
Seshadri Vikram |
2004-08-03 |
| 6175162 |
Semiconductor wafer having a bottom surface protective coating |
Pai-Hsiang Kao, Nikhil Vishwanath Kelkar |
2001-01-16 |
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Chip-on-chip integrated circuit package and method for making the same |
Nikhil Vishwanath Kelkar, John Jackson |
2000-07-04 |
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Pai-Hsiang Kao, Nikhil Vishwanath Kelkar |
2000-06-13 |
| 6023094 |
Semiconductor wafer having a bottom surface protective coating |
Pai-Hsiang Kao, Nikhil Vishwanath Kelkar |
2000-02-08 |
| 4972885 |
Power module for special purpose woodworking tools |
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1990-11-27 |