Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE38789 | Semiconductor wafer having a bottom surface protective coating | William Jeffrey Schaefer, Nikhil Vishwanath Kelkar | 2005-09-06 |
| 6327158 | Metal pads for electrical probe testing on wafer with bump interconnects | Nikhil Vishwanath Kelkar | 2001-12-04 |
| 6249044 | Opaque metallization to cover flip chip die surface for light sensitive semiconductor devices | Nikhil Vishwanath Kelkar | 2001-06-19 |
| 6175162 | Semiconductor wafer having a bottom surface protective coating | William Jeffrey Schaefer, Nikhil Vishwanath Kelkar | 2001-01-16 |
| 6075290 | Surface mount die: wafer level chip-scale package and process for making the same | William Jeffrey Schaefer, Nikhil Vishwanath Kelkar | 2000-06-13 |
| 6023094 | Semiconductor wafer having a bottom surface protective coating | William Jeffrey Schaefer, Nikhil Vishwanath Kelkar | 2000-02-08 |
| 5923995 | Methods and apparatuses for singulation of microelectromechanical systems | Ranjan J. Mathew, Cornelio De Vera | 1999-07-13 |