Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6770513 | Thermally enhanced flip chip packaging arrangement | William Jeffrey Schaefer | 2004-08-03 |
| 6356334 | Liquid crystal display assembly and method for reducing residual stresses | Ranjan J. Mathew | 2002-03-12 |
| 6031216 | Wire bonding methods and apparatus for heat sensitive metallization using a thermally insulated support portion | Inderjit Singh | 2000-02-29 |
| 5969293 | Method and apparatus for doubling back single gauge lead frame | — | 1999-10-19 |