Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11893838 | Vehicle electronic repair and diagnostic system and method | Adam Rainey, Robert S. Kern, Beau Stephen Troychak | 2024-02-06 |
| 11677258 | High voltage winch system leveraging hybrid electric vehicle architecture | Joseph Confer | 2023-06-13 |
| 11292430 | Systems and methods for securing a vehicle and its content after a bailout operation | Robert S. Kern, Adam Rainey, Steve Skikun, Arie Groeneveld, William Gubing +1 more | 2022-04-05 |
| 11002587 | Ultrasonic level sensor with sound trap | Larry Carter, Michael Joseph Rafferty | 2021-05-11 |
| 10829127 | Systems and methods for detecting an impending bailout from a vehicle | Robert S. Kern, Steve Skikun, Jon Ohland, Adam Rainey, William Gubing +1 more | 2020-11-10 |
| 10710596 | Systems and methods for detecting an impending bailout from a vehicle | Robert S. Kern, Steve Skikun, Jon Ohland, Adam Rainey, William Gubing +1 more | 2020-07-14 |
| 10408663 | Ultrasonic level sensor with reflectors | Larry Carter, Michael Joseph Rafferty | 2019-09-10 |
| 8116090 | Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology | Blair E. Coburn, Candice L. Brittain, Peter M. Wallace, Thomas O Perkins, III, Ronald H. Schmidt | 2012-02-14 |
| 7287323 | Materials and structure for a high reliability BGA connection between LTCC and PB boards | William Jeffrey Schaefer | 2007-10-30 |
| 6800815 | Materials and structure for a high reliability bga connection between LTCC and PB boards | William Jeffrey Schaefer | 2004-10-05 |
| 5168344 | Ceramic electronic package design | Jack H. Enloe, Alan L. Kovacs, John W. Lau | 1992-12-01 |
| 5064968 | Domed lid for integrated circuit package | Alan L. Kovacs, Helen Congleton | 1991-11-12 |
| 4788627 | Heat sink device using composite metal alloy | Earl R. Helderman | 1988-11-29 |