Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7045475 | High refractive index glass beads for high retroreflectivity surfaces | Ufuk Senturk, Michael P. Lanci, Raymond P. Jackson | 2006-05-16 |
| 5743841 | Foam composition for treating asbestos-containing materials and method of using same | Jacob Block, Natalia Vera Krupkin, Daniel Reid Kuespert, Gary M. Nishioka, Nigel I. Palmer | 1998-04-28 |
| 5604174 | Metal foil catalyst members by aqueous electrophoretic deposition | Semyon D. Friedman, Awdhoot Vasant Kerkar, Ernest W. Hughes, Rasto Brezny, Jacob Block | 1997-02-18 |
| 5591691 | Metal foil catalyst members by aqueous electrophoretic deposition | Semyon D. Friedman, Awdhoot Vasant Kerkar, Ernest W. Hughes, Rasto Brezny, Jacob Block | 1997-01-07 |
| 5346751 | Electronic package using closed pore composites | Jack H. Enloe | 1994-09-13 |
| 5258337 | Reaction processing of AlN/B.sub.4 C composites | Craig P. Cameron | 1993-11-02 |
| 5250130 | Replica hot pressing technique | Jack H. Enloe | 1993-10-05 |
| 5211786 | Use of permeable materials to improve hot pressing process | Jack H. Enloe | 1993-05-18 |
| 5200249 | Via metallization for AlN ceramic electronic package | Leonard E. Dolhert, Jack H. Enloe, Ellice Y. Luh | 1993-04-06 |
| 5176732 | Method for making low sodium hollow glass microspheres | Jacob Block, Roy W. Rice, Anthony J. Colageo | 1993-01-05 |
| 5168344 | Ceramic electronic package design | Michael Ehlert, Jack H. Enloe, Alan L. Kovacs | 1992-12-01 |
| 5137959 | Thermally conductive elastomer containing alumina platelets | Jacob Block | 1992-08-11 |
| 5102749 | Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite | Jack H. Enloe, Roy W. Rice | 1992-04-07 |
| 5073526 | Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite | Jack H. Enloe, Roy W. Rice | 1991-12-17 |
| 5028650 | Boron nitride sheets | Jack H. Enloe, Christian B. Lundsager | 1991-07-02 |
| 5017434 | Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite | Jack H. Enloe, Roy W. Rice | 1991-05-21 |
| 4920640 | Hot pressing dense ceramic sheets for electronic substrates and for multilayer electronic substrates | Jack H. Enloe, Christian B. Lundsager, Roy W. Rice | 1990-05-01 |
| 4904415 | Oxide glasses having low glass transformation temperatures | Anastasia M. Conlon | 1990-02-27 |
| 4828961 | Imaging process for forming ceramic electronic circuits | Kevin E. Bennet | 1989-05-09 |