Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5346751 | Electronic package using closed pore composites | John W. Lau | 1994-09-13 |
| 5250130 | Replica hot pressing technique | John W. Lau | 1993-10-05 |
| 5211786 | Use of permeable materials to improve hot pressing process | John W. Lau | 1993-05-18 |
| 5200249 | Via metallization for AlN ceramic electronic package | Leonard E. Dolhert, Ellice Y. Luh, John W. Lau | 1993-04-06 |
| 5168344 | Ceramic electronic package design | Michael Ehlert, Alan L. Kovacs, John W. Lau | 1992-12-01 |
| 5164345 | Al.sub.2 O.sub.3 /B.sub.4 C/SiC composite | Roy W. Rice, Leonard E. Dolhert | 1992-11-17 |
| 5102749 | Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite | John W. Lau, Roy W. Rice | 1992-04-07 |
| 5073526 | Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite | John W. Lau, Roy W. Rice | 1991-12-17 |
| 5028650 | Boron nitride sheets | John W. Lau, Christian B. Lundsager | 1991-07-02 |
| 5017434 | Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite | John W. Lau, Roy W. Rice | 1991-05-21 |
| 4920640 | Hot pressing dense ceramic sheets for electronic substrates and for multilayer electronic substrates | John W. Lau, Christian B. Lundsager, Roy W. Rice | 1990-05-01 |