Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5200249 | Via metallization for AlN ceramic electronic package | Leonard E. Dolhert, Jack H. Enloe, John W. Lau | 1993-04-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5200249 | Via metallization for AlN ceramic electronic package | Leonard E. Dolhert, Jack H. Enloe, John W. Lau | 1993-04-06 |