Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825817 | Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules | Matthew Peter, Kurt S. Ketola, Jacques F. Linder | 2004-11-30 |
| 6822880 | Multilayer thin film hydrogen getter and internal signal EMI shield for complex three dimensional electronic package components | Matthew Peter, Kurt S. Ketola, Jacques F. Linder | 2004-11-23 |
| 5770890 | Using a thermal barrier to provide a hermetic seal surface on aluminum nitride substrate electronic packages | Gary Dreyer, Kenneth G. Maish | 1998-06-23 |
| 5705962 | Microwave power dividers and combiners having an adjustable terminating resistor | Robert G. Fleeger | 1998-01-06 |
| 5435733 | Connector assembly for microelectronic multi-chip-module | Gerald P. Chernicky, Christopher Schreiber, Bao Le, Haim Feigenbaum | 1995-07-25 |
| 5268533 | Pre-stressed laminated lid for electronic circuit package | Gary W. Johnson, William A. Vitriol, Clifford L. Shock, Jr. | 1993-12-07 |
| 5168344 | Ceramic electronic package design | Michael Ehlert, Jack H. Enloe, John W. Lau | 1992-12-01 |
| 5064968 | Domed lid for integrated circuit package | Michael Ehlert, Helen Congleton | 1991-11-12 |