Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5315239 | Circuit module connections | — | 1994-05-24 |
| 5268533 | Pre-stressed laminated lid for electronic circuit package | Alan L. Kovacs, Gary W. Johnson, Clifford L. Shock, Jr. | 1993-12-07 |
| 5028473 | Three dimensional microcircuit structure and process for fabricating the same from ceramic tape | Gary W. Johnson | 1991-07-02 |
| 4991283 | Sensor elements in multilayer ceramic tape structures | Gary W. Johnson | 1991-02-12 |
| 4792779 | Trimming passive components buried in multilayer structures | Ramona G. Pond, Raymond L. Brown | 1988-12-20 |
| 4645552 | Process for fabricating dimensionally stable interconnect boards | Raymond L. Brown | 1987-02-24 |
| 4195326 | Predetermined temperature coefficient capacitor | Frank A. Ruegg | 1980-03-25 |