Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502057 | Disk drive suspension having offset swage hub hole | Peter Hahn | 2016-11-22 |
| 9431041 | Comb structure for a disk drive suspension piezoelectric microactuator operating in the D33 mode, and method of manufacturing the same | Christopher Dunn, Peter Hahn, Kuen Chee Ee | 2016-08-30 |
| 8982512 | Low impedance, high bandwidth disk drive suspension circuit | Christopher Dunn | 2015-03-17 |
| 8553364 | Low impedance, high bandwidth disk drive suspension circuit | Christopher Dunn | 2013-10-08 |
| 8395866 | Resilient flying lead and terminus for disk drive suspension | Christopher Dunn | 2013-03-12 |
| 8303792 | High strength electrodeposited suspension conductors | Peter Hahn, Christopher Dunn | 2012-11-06 |
| 8223460 | Asymmetric load beam for improving resonance performance of hard disk drive suspension | Visit Thaveeprungsriporn, Khampon Sittipongpanich | 2012-07-17 |
| 8189301 | Wireless microactuator motor assembly for use in a hard disk drive suspension, and mechanical and electrical connections thereto | — | 2012-05-29 |
| 7957100 | Disk drive gimbal having reduced residual stress and related method of manufacture | — | 2011-06-07 |
| 7829793 | Additive disk drive suspension manufacturing using tie layers for vias and product thereof | Christopher Dunn | 2010-11-09 |
| 7781679 | Disk drive suspension via formation using a tie layer and product | Christopher Dunn | 2010-08-24 |
| 7751153 | Suspension assembly having recessed actuator with simplified lead connection | Sivadasan Kulangara, Shijin Mei, Steve Misuta | 2010-07-06 |
| 7523549 | Dimensionally stabilized flexible circuit fabrication method and product | Chris Dunn | 2009-04-28 |
| 7379271 | Multilayer gimbal suspension element manufacture with co-etchable layers | Christopher Dunn | 2008-05-27 |
| 6595785 | Bump contact force concentration system and method | Eric Dean Jensen, Terry Wang, Scott P. Cohen, Robert E. Daugherty, Blake F. Woith | 2003-07-22 |
| 5579207 | Three-dimensional integrated circuit stacking | Warren W. Hayden, David K. Uyemura, Richard E. Burney, Jacques F. Linder | 1996-11-26 |
| 5435733 | Connector assembly for microelectronic multi-chip-module | Gerald P. Chernicky, Alan L. Kovacs, Bao Le, Haim Feigenbaum | 1995-07-25 |
| 5364277 | Three-dimensional electroformed circuitry | William R. Crumly, Haim Feigenbaum | 1994-11-15 |
| 5354205 | Electrical connections with shaped contacts | Haim Feigenbaum, William R. Crumly | 1994-10-11 |
| 5340296 | Resilient interconnection bridge | William R. Crumly | 1994-08-23 |
| 5326412 | Method for electrodepositing corrosion barrier on isolated circuitry | Haim Feigenbaum | 1994-07-05 |
| 5307561 | Method for making 3-D electrical circuitry | Haim Feigenbaum, William R. Crumly | 1994-05-03 |
| 5306546 | Multi chip module substrate | Haim Feigenbaum, Harold C. Bowers | 1994-04-26 |
| 5261158 | Method of forming a resilient interconnection bridge | William R. Crumly | 1993-11-16 |
| 5245135 | Stackable high density interconnection mechanism (SHIM) | William R. Crumly | 1993-09-14 |