Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10803289 | Fingerprint reader | Eric Dean Jensen | 2020-10-13 |
| 10346672 | Fingerprint reader | Eric Dean Jensen | 2019-07-09 |
| 6547944 | Commercial plating of nanolaminates | Chris M. Schreiber, Mordechay Schlesinger, Robert Martinez, Haim Feigenbaum | 2003-04-15 |
| 6303988 | Wafer scale burn-in socket | — | 2001-10-16 |
| 6166333 | Bumps with plural under-bump dielectric layers | Haim Feigenbaum | 2000-12-26 |
| 6109369 | Chip scale package | Pete Hudson, Robert Joseph Cochrane, Haim Feigenbaum, Eric Dean Jensen | 2000-08-29 |
| 6007669 | Layer to layer interconnect | Haim Feigenbaum, Eric Dean Jensen, Pete Hudson, John De Nuto | 1999-12-28 |
| 5946555 | Wafer level decal for minimal packaging of chips | Haim Feigenbaum | 1999-08-31 |
| 5924193 | Method of making mandrels and circuits therefrom | David B. Swarbrick, Haim Feigenbaum | 1999-07-20 |
| 5896271 | Integrated circuit with a chip on dot and a heat sink | Eric Dean Jensen, Haim Feigenbaum, Chris M. Schreiber | 1999-04-20 |
| 5762845 | Method of making circuit with conductive and non-conductive raised features | — | 1998-06-09 |
| 5600256 | Cast elastomer/membrane test probe assembly | Blake F. Woith, John Pasiecznik, Jr., Robert K. Betz | 1997-02-04 |
| 5563521 | Membrane connector with stretch induced micro scrub | — | 1996-10-08 |
| 5412866 | Method of making a cast elastomer/membrane test probe assembly | Blake F. Woith, John Pasiecznik, Jr., Robert K. Betz | 1995-05-09 |
| 5412539 | Multichip module with a mandrel-produced interconnecting decal | Dennis F. Elwell, Harold C. Bowers | 1995-05-02 |
| 5395253 | Membrane connector with stretch induced micro scrub | — | 1995-03-07 |
| 5364277 | Three-dimensional electroformed circuitry | Christopher Schreiber, Haim Feigenbaum | 1994-11-15 |
| 5354205 | Electrical connections with shaped contacts | Haim Feigenbaum, Christopher Schreiber | 1994-10-11 |
| 5340296 | Resilient interconnection bridge | Christopher Schreiber | 1994-08-23 |
| 5339027 | Rigid-flex circuits with raised features as IC test probes | Blake F. Woith, Jacques F. Linder | 1994-08-16 |
| 5307561 | Method for making 3-D electrical circuitry | Haim Feigenbaum, Christopher Schreiber | 1994-05-03 |
| 5264787 | Rigid-flex circuits with raised features as IC test probes | Blake F. Woith, Jacques F. Linder | 1993-11-23 |
| 5261158 | Method of forming a resilient interconnection bridge | Christopher Schreiber | 1993-11-16 |
| 5245750 | Method of connecting a spaced IC chip to a conductor and the article thereby obtained | Haim Feigenbaum | 1993-09-21 |
| 5245135 | Stackable high density interconnection mechanism (SHIM) | Christopher Schreiber | 1993-09-14 |