Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7595965 | Single PZT actuator for effecting rotation of head suspension loads | Sivadasan Kulangara, Shijin Mei, Steve Misuta | 2009-09-29 |
| 6617510 | Stress relief bend useful in an integrated circuit redistribution patch | Bao Le, Eric Dean Jensen | 2003-09-09 |
| 6547944 | Commercial plating of nanolaminates | Mordechay Schlesinger, Robert Martinez, Haim Feigenbaum, William R. Crumly | 2003-04-15 |
| 6449840 | Column grid array for flip-chip devices | Bao Le | 2002-09-17 |
| 6442039 | Metallic microstructure springs and method of making same | — | 2002-08-27 |
| 6434817 | Method for joining an integrated circuit | Haim Feigenbaum | 2002-08-20 |
| 6402526 | Microelectronic contact assembly | John Steven Szalay | 2002-06-11 |
| 6313402 | Stress relief bend useful in an integrated circuit redistribution patch | Bao Le, Eric Dean Jensen | 2001-11-06 |
| 5896271 | Integrated circuit with a chip on dot and a heat sink | Eric Dean Jensen, William R. Crumly, Haim Feigenbaum | 1999-04-20 |
| 5855063 | Method of making contact pad having metallically anchored elastomeric electrical contacts | Bao Le | 1999-01-05 |
| 5856641 | Switch having raised contact features and a deflectable substrate | Eric Dean Jensen, Bao Le | 1999-01-05 |
| 5790377 | Integral copper column with solder bump flip chip | Bao Le | 1998-08-04 |
| 5738530 | Contact pad having metallically anchored elastomeric electrical contacts | Bao Le | 1998-04-14 |
| 5657207 | Alignment means for integrated circuit chips | Bao Le | 1997-08-12 |