Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406995 | Dry energy storage device electrode and methods of making the same | Hieu Minh Duong, Jian Hong | 2025-09-02 |
| 12374692 | Compositions and methods for parallel processing of electrode film mixtures | Ziying Wang, Hieu Minh Duong | 2025-07-29 |
| 12230798 | Compositions and methods for silicon containing dry anode films | Joon Ho Shin, Hieu Minh Duong | 2025-02-18 |
| 12218303 | Prelithiated hybridized energy storage device | Hieu Minh Duong, Porter Mitchell, Mohammed-Yazid Saidi, Joon Ho Shin | 2025-02-04 |
| 11888108 | Prelithiated hybridized energy storage device | Hieu Minh Duong, Porter Mitchell, Mohammed-Yazid Saidi, Joon Ho Shin | 2024-01-30 |
| 11876230 | Dry energy storage device electrode and methods of making the same | Hieu Minh Duong, Jian Hong | 2024-01-16 |
| 11637289 | Compositions and methods for parallel processing of electrode film mixtures | Ziying Wang, Hieu Minh Duong | 2023-04-25 |
| 10840540 | Prelithiated hybridized energy storage device | Hieu Minh Duong, Porter Mitchell, Mohammed-Yazid Saidi, Joon Ho Shin | 2020-11-17 |
| 10741843 | Dry energy storage device electrode and methods of making the same | Hieu Minh Duong, Jian Hong | 2020-08-11 |
| 7504839 | Flexible circuit with micro-sized probe tips and a method of making the same | Bao Le, Long Hoang, Robert K. Betz | 2009-03-17 |
| 6614659 | De-mountable, solderless in-line lead module package with interface | Blake F. Woith, John Steven Szalay, Terry Wang | 2003-09-02 |
| 6547944 | Commercial plating of nanolaminates | Chris M. Schreiber, Mordechay Schlesinger, Robert Martinez, William R. Crumly | 2003-04-15 |
| 6434817 | Method for joining an integrated circuit | Chris M. Schreiber | 2002-08-20 |
| 6358064 | Z-axis electrical interconnect | John Steven Szalay, Eric Dean Jensen, Terry Wang | 2002-03-19 |
| 6166333 | Bumps with plural under-bump dielectric layers | William R. Crumly | 2000-12-26 |
| 6109369 | Chip scale package | William R. Crumly, Pete Hudson, Robert Joseph Cochrane, Eric Dean Jensen | 2000-08-29 |
| 6007669 | Layer to layer interconnect | William R. Crumly, Eric Dean Jensen, Pete Hudson, John De Nuto | 1999-12-28 |
| 5946555 | Wafer level decal for minimal packaging of chips | William R. Crumly | 1999-08-31 |
| 5924193 | Method of making mandrels and circuits therefrom | William R. Crumly, David B. Swarbrick | 1999-07-20 |
| 5896271 | Integrated circuit with a chip on dot and a heat sink | Eric Dean Jensen, William R. Crumly, Chris M. Schreiber | 1999-04-20 |
| 5777484 | Device for testing integrated circuit chips during vibration | Blake F. Woith, John Steven Szalay | 1998-07-07 |
| 5708557 | Puncture-resistant electrostatic chuck with flat surface and method of making the same | Bao Le, Randy Thomas, Dong Vo | 1998-01-13 |
| 5435733 | Connector assembly for microelectronic multi-chip-module | Gerald P. Chernicky, Christopher Schreiber, Alan L. Kovacs, Bao Le | 1995-07-25 |
| 5378982 | Test probe for panel having an overlying protective member adjacent panel contacts | John Steven Szalay, Blake F. Woith | 1995-01-03 |
| 5364277 | Three-dimensional electroformed circuitry | William R. Crumly, Christopher Schreiber | 1994-11-15 |