Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5641546 | Passivation of electronic modules using high density plasmas | Charles B. Zarowin | 1997-06-24 |
| 5412539 | Multichip module with a mandrel-produced interconnecting decal | William R. Crumly, Harold C. Bowers | 1995-05-02 |
| 5318820 | HTCC/LTCC use of multiple ceramic tapes in high rate production | Hal D. Smith | 1994-06-07 |
| 5315154 | Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition | — | 1994-05-24 |