Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5583668 | Holographic replication of copy film to hologram master | Ronald T. Smith | 1996-12-10 |
| 5438167 | Ferrimagnetic vias within multi-layer 3-dimensional structures/substrates | Robert F. McClanahan, Robert D. Washburn, Andrew A. Shapiro | 1995-08-01 |
| 5318820 | HTCC/LTCC use of multiple ceramic tapes in high rate production | Dennis F. Elwell | 1994-06-07 |
| 5217216 | HTCC/LTCC substrate blanker/multi-layer collation die | George P. Pelzman, Joseph Jacobs | 1993-06-08 |
| 5178051 | Magnetic punch die retention for HTCC/LTCC fabrication | George P. Pelzman | 1993-01-12 |
| 5164699 | Via resistors within-multi-layer, 3 dimensional structures substrates | Robert F. McClanahan, Andrew A. Shapiro, Raymond L. Brown | 1992-11-17 |
| 5055966 | Via capacitors within multi-layer, 3 dimensional structures/substrates | Robert F. McClanahan, Andrew A. Shapiro, George P. Pelzman | 1991-10-08 |