Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5217216 | HTCC/LTCC substrate blanker/multi-layer collation die | Hal D. Smith, Joseph Jacobs | 1993-06-08 |
| 5178051 | Magnetic punch die retention for HTCC/LTCC fabrication | Hal D. Smith | 1993-01-12 |
| 5055966 | Via capacitors within multi-layer, 3 dimensional structures/substrates | Hal D. Smith, Robert F. McClanahan, Andrew A. Shapiro | 1991-10-08 |
| 4998712 | Printed wiring board fixture apparatus | Joon-Ho Park, Stanley Taketani, Han C. Leung | 1991-03-12 |