Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5963426 | Electronic micropackaging assembly and its fabrication | Ronald L. Williams | 1999-10-05 |
| 5579207 | Three-dimensional integrated circuit stacking | David K. Uyemura, Richard E. Burney, Christopher Schreiber, Jacques F. Linder | 1996-11-26 |