Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5064968 | Domed lid for integrated circuit package | Alan L. Kovacs, Michael Ehlert | 1991-11-12 |
| 5007576 | Testable ribbon bonding method and wedge bonding tool for microcircuit device fabrication | Carol L. Slaton, Angelo Koudounaris, Gerald B. Smith, Vicente Soto | 1991-04-16 |