Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5513429 | Method of reworking bonded lead wires | — | 1996-05-07 |
| 5414919 | Apparatus for removing metallized leads bonded to metallized bond pads | — | 1995-05-16 |
| 5153981 | Universal apparatus for forming lead wires | — | 1992-10-13 |
| 5007576 | Testable ribbon bonding method and wedge bonding tool for microcircuit device fabrication | Helen Congleton, Carol L. Slaton, Angelo Koudounaris, Gerald B. Smith | 1991-04-16 |