| 11554458 |
Polishing head, wafer polishing apparatus using the same, and wafer polishing method using the same |
Yuki Nakano, Katsuhisa SUGIMORI, Kazuaki Kozasa, Katsutoshi Yamamoto, Takayuki Kihara +1 more |
2023-01-17 |
| 9250014 |
Vacuum storage method and device for crystalline material |
Yukichi Horioka, Hirotsugu Sanada |
2016-02-02 |
| 7311586 |
Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
Gerard S. Maloney, Jason Price, Scott Chin, Malik Charif |
2007-12-25 |
| 7118456 |
Polishing head, retaining ring for use therewith and method fo polishing a substrate |
Gerard Moloney |
2006-10-10 |
| 7029382 |
Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
Gerard S. Maloney, Jason Price, Scott Chin, Malik Charif |
2006-04-18 |
| 6966822 |
System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
Gerard Moloney, Huey-Ming Wang, David A. Hansen, Alejandro Reyes |
2005-11-22 |
| 6893327 |
Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface |
Gerard Moloney, Huey-Ming Wang, Junsheng Yang |
2005-05-17 |
| 6887132 |
Slurry distributor for chemical mechanical polishing apparatus and method of using the same |
Gerard Moloney, Jun Liu, Junsheng Yang, Ernesto Saldana, Cormac Walsh +1 more |
2005-05-03 |
| 6641461 |
Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal |
Huey-Ming Wang, David A. Hansen, Gerard Moloney |
2003-11-04 |
| 6623343 |
System and method for CMP head having multi-pressure annular zone subcarrier material removal control |
Gerard Moloney, Huey-Ming Wang, David A. Hansen, Alejandro Reyes |
2003-09-23 |
| 6558232 |
System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
Gerard Moloney, Huey-Ming Wang, David A. Hansen, Alejandro Reyes |
2003-05-06 |
| 6540590 |
Chemical mechanical polishing apparatus and method having a rotating retaining ring |
Huey-Ming Wang |
2003-04-01 |
| 6527625 |
Chemical mechanical polishing apparatus and method having a soft backed polishing head |
David A. Hansen, Gerard Moloney |
2003-03-04 |
| 6508696 |
Wafer-polishing head and polishing apparatus having the same |
Tatsunori Kobayashi, Hiroshi Tanaka |
2003-01-21 |
| 6506105 |
System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control |
Gerard Moloney, Huey-Ming Wang, David A. Hansen, Alejandro Reyes |
2003-01-14 |
| 6398906 |
Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer |
Tatsunori Kobayashi, Hiroshi Tanaka |
2002-06-04 |
| 6368189 |
Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
Gerard S. Maloney, Jason Price, Scott Chin, Malek Charif |
2002-04-09 |
| 6346038 |
Wafer loading/unloading device and method for producing wafers |
Yoshie Kaido, Masahito Komasaki |
2002-02-12 |
| 5527209 |
Wafer polisher head adapted for easy removal of wafers |
Konstantine Volodarsky, Herbert W. Owens, Jr., Jan H. King |
1996-06-18 |
| 5443416 |
Rotary union for coupling fluids in a wafer polishing apparatus |
Konstantine Volodarsky, Herbert W. Owens, Jr., Jan H. King |
1995-08-22 |