GM

Gerard S. Maloney

EB Ebara: 3 patents #598 of 1,611Top 40%
MM Mitsubishi Materials: 2 patents #498 of 1,543Top 35%
Overall (All Time): #1,033,779 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7311586 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure Jason Price, Scott Chin, Jiro Kajiwara, Malik Charif 2007-12-25
7044838 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring Scott Chin, John Geraghty, William Dyson, Jr., Tanlin Dickey 2006-05-16
7029382 Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure Jason Price, Scott Chin, Jiro Kajiwara, Malik Charif 2006-04-18
6368189 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure Jason Price, Scott Chin, Jiro Kajiwara, Malek Charif 2002-04-09
6231428 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring Scott Chin, John Geraghty, William Dyson, Jr., Tanlin Dickey 2001-05-15