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Kunihiko Sakurai, Huey-Ming Wang, Jun Liu, Peter Lao |
2008-02-05 |
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Cormac Walsh, Jun Liu, A. Ernesto Saldana |
2006-10-24 |
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Polishing head, retaining ring for use therewith and method fo polishing a substrate |
Jiro Kajiwara |
2006-10-10 |
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Huey-Ming Wang, Peter Lao |
2006-02-28 |
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System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
Jiro Kajiwara, Huey-Ming Wang, David A. Hansen, Alejandro Reyes |
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2005-07-12 |
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Jiro Kajiwara, Huey-Ming Wang, Junsheng Yang |
2005-05-17 |
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Slurry distributor for chemical mechanical polishing apparatus and method of using the same |
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2005-05-03 |
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Huey-Ming Wang, David A. Hansen, Jiro Kajiwara |
2003-11-04 |
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2003-09-23 |
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System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
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Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
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