Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9236316 | Semiconductor device and method for manufacturing the same | Junji Fujino, Shohei Ogawa | 2016-01-12 |
| 7276923 | Semiconductor device test probe | Megumi Takemoto, Shigeki Maekawa, Yoshinori Deguchi, Kazunobu Miki | 2007-10-02 |
| 7274195 | Semiconductor device test probe | Megumi Takemoto, Shigeki Maekawa, Yoshinori Deguchi, Kazunobu Miki | 2007-09-25 |
| 7112976 | Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested | Yasushi Tokumo, Shigeki Maekawa, Shigeru Takada | 2006-09-26 |
| 6989681 | Socket for testing a semiconductor device and a connecting sheet used for the same | Shigeki Maekawa | 2006-01-24 |
| 6979843 | Power semiconductor device | Dai Nakajima, Hideaki Chuma | 2005-12-27 |
| 6888344 | Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter | Shigeki Maekawa, Megumi Takemoto, Kazunobu Miki, Mutsumi Kano, Takahiro Nagata | 2005-05-03 |
| 6885204 | Probe card, and testing apparatus having the same | Megumi Takemoto, Shigeki Maekawa, Yuetsu Watanabe | 2005-04-26 |
| 6882069 | Vehicle AC generator with rectifier diode package disposed between cooling plates | Toshiaki Kashihara, Shigeki Maekawa | 2005-04-19 |
| 6867484 | Semiconductor device | Dai Nakajima, Hideaki Chuma | 2005-03-15 |
| 6794890 | Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested | Yasushi Tokumo, Shigeki Maekawa, Shigeru Takada | 2004-09-21 |
| 6741086 | Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus | Shigeki Maekawa, Megumi Takemoto | 2004-05-25 |
| 6667626 | Probe card, and testing apparatus having the same | Megumi Takemoto, Shigeki Maekawa, Yuetsu Watanabe | 2003-12-23 |
| 6646455 | Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter | Shigeki Maekawa, Megumi Takemoto, Kazunobu Miki, Mutsumi Kano, Takahiro Nagata | 2003-11-11 |
| 6633176 | Semiconductor device test probe having improved tip portion and manufacturing method thereof | Megumi Takemoto, Shigeki Maekawa, Yoshinori Deguchi, Kazunobu Miki | 2003-10-14 |
| 6628127 | Probe card for testing semiconductor integrated circuit and method of manufacturing the same | Megumi Takemoto, Shigeki Maekawa, Yoshinori Deguchi, Masahiro Tanaka | 2003-09-30 |
| 6461465 | Apparatus for manufacturing liquid crystal panel and method thereof | Masahiko Tada, Kohei Adachi, Hiroki Toyoshima, Susumu Kono, Kazuo Yoshida +1 more | 2002-10-08 |
| 6190488 | Apparatus for manufacturing liquid crystal panel and method thereof | Masahiko Tada, Kohei Adachi, Hiroki Toyoshima, Susumu Kono, Kazuo Yoshida +1 more | 2001-02-20 |
| 6118172 | High-frequency circuit device and manufacturing method thereof | Masao Yamawaki, Tatsuhiko Ikeda, Noriharu Suematsu | 2000-09-12 |
| 5637917 | Lead frame assembly for a semiconductor device | Yoshihiro Tomita, Michitaka Kimura | 1997-06-10 |
| 5609287 | Solder material, junctioning method, junction material, and semiconductor device | Goro Izuta, Shunichi Abe, Yoshirou Nishinaka, Katsuyuki Fukutome, Naoto Ueda +2 more | 1997-03-11 |
| 5251803 | Ceramic-metal composite substrate and method for producing the same | Masaru Okada | 1993-10-12 |
| 5153077 | Ceramic-metal composite substrate | Masaru Okada | 1992-10-06 |