MT

Megumi Takemoto

Mitsubishi Electric: 11 patents #2,558 of 25,717Top 10%
Overall (All Time): #468,596 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
7825677 Test jig for testing a packaged high frequency semiconductor device Tomoyuki Kamiyama 2010-11-02
7276923 Semiconductor device test probe Shigeki Maekawa, Yoshihiro Kashiba, Yoshinori Deguchi, Kazunobu Miki 2007-10-02
7274195 Semiconductor device test probe Shigeki Maekawa, Yoshihiro Kashiba, Yoshinori Deguchi, Kazunobu Miki 2007-09-25
6888344 Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter Shigeki Maekawa, Kazunobu Miki, Mutsumi Kano, Takahiro Nagata, Yoshihiro Kashiba 2005-05-03
6885204 Probe card, and testing apparatus having the same Shigeki Maekawa, Yoshihiro Kashiba, Yuetsu Watanabe 2005-04-26
6741086 Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus Shigeki Maekawa, Yoshihiro Kashiba 2004-05-25
6667626 Probe card, and testing apparatus having the same Shigeki Maekawa, Yoshihiro Kashiba, Yuetsu Watanabe 2003-12-23
6646455 Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter Shigeki Maekawa, Kazunobu Miki, Mutsumi Kano, Takahiro Nagata, Yoshihiro Kashiba 2003-11-11
6633176 Semiconductor device test probe having improved tip portion and manufacturing method thereof Shigeki Maekawa, Yoshihiro Kashiba, Yoshinori Deguchi, Kazunobu Miki 2003-10-14
6628127 Probe card for testing semiconductor integrated circuit and method of manufacturing the same Shigeki Maekawa, Yoshihiro Kashiba, Yoshinori Deguchi, Masahiro Tanaka 2003-09-30
5972069 Metallic material made from tungsten or molybdenum, method of producing the metallic material, and secondary product material using the metallic material Shigeki Maekawa 1999-10-26