Issued Patents All Time
Showing 26–50 of 102 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7626238 | Semiconductor devices having antireflective material | Richard Holscher, Tom Glass | 2009-12-01 |
| 7589015 | Fabrication of semiconductor devices using anti-reflective coatings | Gurtej S. Sandhu | 2009-09-15 |
| 7576441 | Boron-doped amorphous carbon film for use as a hard etch mask during the formation of a semiconductor device | Gurtej S. Sandhu | 2009-08-18 |
| 7576400 | Circuitry and gate stacks | Ravi Iyer, Thomas R. Glass, Richard Holscher, Ardavan Niroomand, Linda K. Somerville +1 more | 2009-08-18 |
| 7541635 | Semiconductor fabrication using a collar | Kevin J. Torek, Kevin R. Shea, Niraj Rana | 2009-06-02 |
| 7521354 | Low k interlevel dielectric layer fabrication methods | Weimin Li, William Budge | 2009-04-21 |
| 7470606 | Masking methods | Gurtej S. Sandhu | 2008-12-30 |
| 7390738 | Fabrication of semiconductor devices using anti-reflective coatings | Gurtej S. Sandhu | 2008-06-24 |
| 7354631 | Chemical vapor deposition apparatus and methods | Jeff Fuss, Kevin Hamer | 2008-04-08 |
| 7341957 | Masking structure having multiple layers including amorphous carbon layer | Gurtej S. Sandhu, Weimin Li | 2008-03-11 |
| 7315074 | Use of DAR coating to modulate the efficiency of laser fuse blows | Mark Fischer, Thomas R. Glass, Kunal R. Parekh, Gurtej S. Sandhu | 2008-01-01 |
| 7298024 | Transparent amorphous carbon structure in semiconductor devices | David Williams, Weimin Li | 2007-11-20 |
| 7279414 | Method of forming interconnect structure with interlayer dielectric | Mark E. Jost | 2007-10-09 |
| 7279118 | Compositions of matter and barrier layer compositions | Weimin Li | 2007-10-09 |
| 7270917 | Prevention of photoresist scumming | Jingyi Bai | 2007-09-18 |
| 7253118 | Pitch reduced patterns relative to photolithography features | Luan C. Tran, William T. Rericha, John Lee, Raman Alapati, Sheron Honarkhah +7 more | 2007-08-07 |
| 7244648 | Methods of forming semiconductor constructions | Er-Xuan Ping | 2007-07-17 |
| 7220683 | Transparent amorphous carbon structure in semiconductor devices | David Williams, Weimin Li | 2007-05-22 |
| 7186642 | Low temperature nitride used as Cu barrier layer | Eden Zielinski, Fred Fishburn | 2007-03-06 |
| 7175944 | Prevention of photoresist scumming | Jingyi Bai | 2007-02-13 |
| 7132201 | Transparent amorphous carbon structure in semiconductor devices | Weimin Li | 2006-11-07 |
| 7129180 | Masking structure having multiple layers including an amorphous carbon layer | Gurtej S. Sandhu, Weimin Li | 2006-10-31 |
| 7109089 | Semiconductor fabrication using a collar | Kevin J. Torek, Kevin R. Shea, Niraj Rana | 2006-09-19 |
| 7105431 | Masking methods | Gurtej S. Sandhu | 2006-09-12 |
| 7095095 | Semiconductor constructions | Tongbi Jiang | 2006-08-22 |