Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741602 | Back side illuminated CMOS image sensor arrays | Hirofumi Komori | 2020-08-11 |
| 9876045 | Back side illuminated CMOS image sensor arrays | Hirofumi Komori | 2018-01-23 |
| 8878264 | Global shutter pixel with improved efficiency | Sergey Velichko | 2014-11-04 |
| 8673787 | Method to reduce charge buildup during high aspect ratio contact etch | Gurtej S. Sandhu, Max Hineman, Daniel A. Steckert, Shane J. Trapp, Tony Schrock | 2014-03-18 |
| 8598632 | Integrated circuit having pitch reduced patterns relative to photoithography features | Luan C. Tran, William T. Rericha, John Lee, Ramakanth Alapati, Sheron Honarkhah +7 more | 2013-12-03 |
| 8207576 | Pitch reduced patterns relative to photolithography features | Luan C. Tran, William T. Rericha, John Lee, Ramakanth Alapati, Sheron Honarkhah +7 more | 2012-06-26 |
| 8129093 | Prevention of photoresist scumming | Zhiping Yin | 2012-03-06 |
| 8123968 | Multiple deposition for integration of spacers in pitch multiplication process | Gurtej S. Sandhu, Shuang Meng | 2012-02-28 |
| 8119535 | Pitch reduced patterns relative to photolithography features | Luan C. Tran, William T. Rericha, John Lee, Ramakanth Alapati, Sheron Honarkhah +7 more | 2012-02-21 |
| 8048812 | Pitch reduced patterns relative to photolithography features | Luan C. Tran, William T. Rericha, John Lee, Ramakanth Alapati, Sheron Honarkhah +7 more | 2011-11-01 |
| 7985692 | Method to reduce charge buildup during high aspect ratio contact etch | Gurtej S. Sandhu, Max Hineman, Daniel A. Steckert, Shane J. Trapp, Tony Schrock | 2011-07-26 |
| 7884022 | Multiple deposition for integration of spacers in pitch multiplication process | Gurtej S. Sandhu, Shuang Meng | 2011-02-08 |
| 7718540 | Pitch reduced patterns relative to photolithography features | Luan C. Tran, William T. Rericha, John Lee, Ramakanth Alapati, Sheron Honarkhah +7 more | 2010-05-18 |
| 7704673 | Prevention of photoresist scumming | Zhiping Yin | 2010-04-27 |
| 7651951 | Pitch reduced patterns relative to photolithography features | Luan C. Tran, William T. Rericha, John Lee, Ramakanth Alapati, Sheron Honarkhah +7 more | 2010-01-26 |
| 7390746 | Multiple deposition for integration of spacers in pitch multiplication process | Gurtej S. Sandhu, Shuang Meng | 2008-06-24 |
| 7344975 | Method to reduce charge buildup during high aspect ratio contact etch | Gurtej S. Sandhu, Max Hineman, Daniel A. Steckert, Shane J. Trapp, Tony Schrock | 2008-03-18 |
| 7270917 | Prevention of photoresist scumming | Zhiping Yin | 2007-09-18 |
| 7259079 | Methods for filling high aspect ratio trenches in semiconductor layers | Weimin Li, William Budge | 2007-08-21 |
| 7253118 | Pitch reduced patterns relative to photolithography features | Luan C. Tran, William T. Rericha, John Lee, Raman Alapati, Sheron Honarkhah +7 more | 2007-08-07 |
| 7175944 | Prevention of photoresist scumming | Zhiping Yin | 2007-02-13 |
| 6982207 | Methods for filling high aspect ratio trenches in semiconductor layers | Weimin Li, William Budge | 2006-01-03 |