Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7632737 | Protection in integrated circuits | Neal R. Rueger, Weimin Li | 2009-12-15 |
| 7521354 | Low k interlevel dielectric layer fabrication methods | Weimin Li, Zhiping Yin | 2009-04-21 |
| 7501691 | Trench insulation structures including an oxide liner and oxidation barrier | John Smythe | 2009-03-10 |
| 7494894 | Protection in integrated circuits | Neal R. Rueger, Weimin Li | 2009-02-24 |
| 7479440 | Method of forming an isolation structure that includes forming a silicon layer at a base of the recess | John Smythe | 2009-01-20 |
| 7273793 | Methods of filling gaps using high density plasma chemical vapor deposition | Neal R. Rueger, Weimin Li, Gurtej S. Sandhu | 2007-09-25 |
| 7271463 | Trench insulation structures including an oxide liner that is thinner along the walls of the trench than along the base | John Smythe | 2007-09-18 |
| 7259079 | Methods for filling high aspect ratio trenches in semiconductor layers | Jingyi Bai, Weimin Li | 2007-08-21 |
| 7219114 | Fast approximation to the spherical linear interpolation function | — | 2007-05-15 |
| 7214979 | Selectively deposited silicon oxide layers on a silicon substrate | Gurtej S. Sandhu, Christopher W. Hill | 2007-05-08 |
| 7202183 | Method of filling gaps and methods of depositing materials using high density plasma chemical vapor deposition | Neal R. Rueger, Weimin Li, Gurtej S. Sandhu | 2007-04-10 |
| 7192893 | Use of linear injectors to deposit uniform selective ozone TEOS oxide film by pulsing reactants on and off | Gurtej S. Sandhu, Christopher W. Hill | 2007-03-20 |
| 7078356 | Low K interlevel dielectric layer fabrication methods | Weimin Li, Zhiping Yin | 2006-07-18 |
| 7067414 | Low k interlevel dielectric layer fabrication methods | Weimin Li, Zhiping Yin | 2006-06-27 |
| 7067415 | Low k interlevel dielectric layer fabrication methods | Weimin Li, Zhiping Yin | 2006-06-27 |
| 7056833 | Methods of filling gaps and methods of depositing materials using high density plasma chemical vapor deposition | Neal R. Rueger, Weimin Li, Gurtej S. Sandhu | 2006-06-06 |
| 6982207 | Methods for filling high aspect ratio trenches in semiconductor layers | Jingyi Bai, Weimin Li | 2006-01-03 |
| 6617230 | Use of selective ozone teos oxide to create variable thickness layers and spacers | Gurtej S. Sandhu, Christopher W. Hill | 2003-09-09 |
| 6602807 | Use of linear injectors to deposit uniform selective ozone TEOS oxide film by pulsing reactants on and off | Gurtej S. Sandhu, Christopher W. Hill | 2003-08-05 |
| 6503851 | Use of linear injectors to deposit uniform selective ozone TEOS oxide film by pulsing reactants on and off | Gurtej S. Sandhu, Christopher W. Hill | 2003-01-07 |
| 6368986 | Use of selective ozone TEOS oxide to create variable thickness layers and spacers | Gurtej S. Sandhu, Christopher W. Hill | 2002-04-09 |