William Budge — 21 Patents at Micron

William Budge has been granted 21 US patents while listed as an inventor at Micron. The first was granted in 2002 and the most recent in December 2009. William Budge ranks #201,324 of 4,157,543 US inventors in our database (top 4.8%). Patent records list William Budge in Homedale, ID, US.

Patents per Year

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
7632737	Protection in integrated circuits	Neal R. Rueger, Weimin Li	2009-12-15	$5,540,000
7521354	Low k interlevel dielectric layer fabrication methods	Weimin Li, Zhiping Yin	2009-04-21	$3,996,000
7501691	Trench insulation structures including an oxide liner and oxidation barrier	John Smythe	2009-03-10	$2,830,000
7494894	Protection in integrated circuits	Neal R. Rueger, Weimin Li	2009-02-24	$2,406,000
7479440	Method of forming an isolation structure that includes forming a silicon layer at a base of the recess	John Smythe	2009-01-20	$3,797,000
7273793	Methods of filling gaps using high density plasma chemical vapor deposition	Neal R. Rueger, Weimin Li, Gurtej S. Sandhu	2007-09-25	$1,063,000
7271463	Trench insulation structures including an oxide liner that is thinner along the walls of the trench than along the base	John Smythe	2007-09-18	$885,000
7259079	Methods for filling high aspect ratio trenches in semiconductor layers	Jingyi Bai, Weimin Li	2007-08-21	$2,251,000
7219114	Fast approximation to the spherical linear interpolation function	—	2007-05-15
7214979	Selectively deposited silicon oxide layers on a silicon substrate	Gurtej S. Sandhu, Christopher W. Hill	2007-05-08	$1,698,000
7202183	Method of filling gaps and methods of depositing materials using high density plasma chemical vapor deposition	Neal R. Rueger, Weimin Li, Gurtej S. Sandhu	2007-04-10	$2,167,000
7192893	Use of linear injectors to deposit uniform selective ozone TEOS oxide film by pulsing reactants on and off	Gurtej S. Sandhu, Christopher W. Hill	2007-03-20	$2,361,000
7078356	Low K interlevel dielectric layer fabrication methods	Weimin Li, Zhiping Yin	2006-07-18	$2,294,000
7067414	Low k interlevel dielectric layer fabrication methods	Weimin Li, Zhiping Yin	2006-06-27	$1,742,000
7067415	Low k interlevel dielectric layer fabrication methods	Weimin Li, Zhiping Yin	2006-06-27	$1,742,000
7056833	Methods of filling gaps and methods of depositing materials using high density plasma chemical vapor deposition	Neal R. Rueger, Weimin Li, Gurtej S. Sandhu	2006-06-06	$2,297,000
6982207	Methods for filling high aspect ratio trenches in semiconductor layers	Jingyi Bai, Weimin Li	2006-01-03	$1,955,000
6617230	Use of selective ozone teos oxide to create variable thickness layers and spacers	Gurtej S. Sandhu, Christopher W. Hill	2003-09-09	$3,971,000
6602807	Use of linear injectors to deposit uniform selective ozone TEOS oxide film by pulsing reactants on and off	Gurtej S. Sandhu, Christopher W. Hill	2003-08-05	$4,531,000
6503851	Use of linear injectors to deposit uniform selective ozone TEOS oxide film by pulsing reactants on and off	Gurtej S. Sandhu, Christopher W. Hill	2003-01-07	$2,731,000
6368986	Use of selective ozone TEOS oxide to create variable thickness layers and spacers	Gurtej S. Sandhu, Christopher W. Hill	2002-04-09	$7,963,000

William Budge — 21 Patents

Patents per Year

Issued Patents All Time

Patent Widget