Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8673787 | Method to reduce charge buildup during high aspect ratio contact etch | Gurtej S. Sandhu, Max Hineman, Daniel A. Steckert, Jingyi Bai, Shane J. Trapp | 2014-03-18 |
| 7985692 | Method to reduce charge buildup during high aspect ratio contact etch | Gurtej S. Sandhu, Max Hineman, Daniel A. Steckert, Jingyi Bai, Shane J. Trapp | 2011-07-26 |
| 7857982 | Methods of etching features into substrates | Mirzafer Abatchev, Gurtej S. Sandhu, Aaron R. Wilson | 2010-12-28 |
| 7344975 | Method to reduce charge buildup during high aspect ratio contact etch | Gurtej S. Sandhu, Max Hineman, Daniel A. Steckert, Jingyi Bai, Shane J. Trapp | 2008-03-18 |