Issued Patents All Time
Showing 101–125 of 149 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7892937 | Methods of forming capacitors | Niraj Rana, Prashant Raghu, Jim Hofmann, Neil Greeley | 2011-02-22 |
| 7837805 | Methods for treating surfaces | Gurtej S. Sandhu | 2010-11-23 |
| 7786016 | Methods of uniformly removing silicon oxide and a method of removing a sacrificial oxide | Gurtej S. Sandhu, Joseph Neil Greeley | 2010-08-31 |
| 7749327 | Methods for treating surfaces | Gurtej S. Sandhu | 2010-07-06 |
| 7750477 | Through-hole contacts in a semiconductor device | — | 2010-07-06 |
| 7713817 | Methods of forming semiconductor structures | Dinesh Chopra, Fred Fishburn | 2010-05-11 |
| 7666788 | Methods for forming conductive vias in semiconductor device components | — | 2010-02-23 |
| 7662719 | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods | Dinesh Chopra | 2010-02-16 |
| 7608904 | Semiconductor device components with conductive vias and systems including the components | — | 2009-10-27 |
| 7603772 | Methods of fabricating substrates including one or more conductive vias | Warren M. Farnworth, Steven M. McDonald, William M. Hiatt | 2009-10-20 |
| 7594322 | Methods of fabricating substrates including at least one conductive via | Warren M. Farnworth, Steven M. McDonald, William M. Hiatt | 2009-09-29 |
| 7345350 | Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias | — | 2008-03-18 |
| 7335935 | Semiconductor structures | Dinesh Chopra, Fred Fishburn | 2008-02-26 |
| 7316063 | Methods of fabricating substrates including at least one conductive via | Warren M. Farnworth, Steven M. McDonald, William M. Hiatt | 2008-01-08 |
| 7273816 | Methods for removal of organic materials | — | 2007-09-25 |
| 7265052 | Methods of forming conductive through-wafer vias | — | 2007-09-04 |
| 7256116 | Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts | William M. Hiatt, Warren M. Farnworth, Charles M. Watkins | 2007-08-14 |
| 7244678 | Methods for planarization of Group VIII metal-containing surfaces using complexing agents | Rita J. Klein | 2007-07-17 |
| 7226863 | Methods for removal of organic materials | — | 2007-06-05 |
| 7208368 | Methods of forming spaced conductive regions, and methods of forming capacitor constructions | Theodore M. Taylor | 2007-04-24 |
| 7183133 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, Warren M. Farnworth, William M. Hiatt | 2007-02-27 |
| 7129573 | System having semiconductor component with encapsulated, bonded, interconnect contacts | William M. Hiatt, Warren M. Farnworth, Charles M. Watkins | 2006-10-31 |
| 7122420 | Methods of recessing conductive material and methods of forming capacitor constructions | Theodore M. Taylor | 2006-10-17 |
| 7118686 | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods | Dinesh Chopra | 2006-10-10 |
| 7115515 | Methods for forming capacitor structures | — | 2006-10-03 |