Issued Patents All Time
Showing 126–149 of 149 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7042010 | Intermediate semiconductor device having activated oxide-based layer for electroless plating | — | 2006-05-09 |
| 7005379 | Semiconductor processing methods for forming electrical contacts | Dinesh Chopra, Fred Fishburn | 2006-02-28 |
| 6969301 | Filling plugs through chemical mechanical polish | — | 2005-11-29 |
| 6946392 | Filling plugs through chemical mechanical polish | — | 2005-09-20 |
| 6936536 | Methods of forming conductive through-wafer vias | — | 2005-08-30 |
| 6906418 | Semiconductor component having encapsulated, bonded, interconnect contacts | William M. Hiatt, Warren M. Farnworth, Charles M. Watkins | 2005-06-14 |
| 6900128 | Activation of oxides for electroless plating | — | 2005-05-31 |
| 6884723 | Methods for planarization of group VIII metal-containing surfaces using complexing agents | Rita J. Klein | 2005-04-26 |
| 6872659 | Activation of oxides for electroless plating | — | 2005-03-29 |
| 6861309 | Methods of forming spaced conductive regions, and methods of forming capacitor constructions | Theodore M. Taylor | 2005-03-01 |
| 6852627 | Conductive through wafer vias | Warren M. Farnworth | 2005-02-08 |
| 6830500 | Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods | Dinesh Chopra | 2004-12-14 |
| 6803303 | Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts | William M. Hiatt, Warren M. Farnworth, Charles M. Watkins | 2004-10-12 |
| 6787450 | High aspect ratio fill method and resulting structure | Paul A. Morgan | 2004-09-07 |
| 6757971 | Filling plugs through chemical mechanical polish | — | 2004-07-06 |
| 6759751 | Constructions comprising solder bumps | — | 2004-07-06 |
| 6756682 | High aspect ratio fill method and resulting structure | Paul A. Morgan | 2004-06-29 |
| 6710442 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, Warren M. Farnworth, William M. Hiatt | 2004-03-23 |
| 6706632 | Methods for forming capacitor structures; and methods for removal of organic materials | — | 2004-03-16 |
| 6703272 | Methods of forming spaced conductive regions, and methods of forming capacitor constructions | Theodore M. Taylor | 2004-03-09 |
| 6602117 | Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods | Dinesh Chopra | 2003-08-05 |
| 6586043 | Methods of electroless deposition of nickel, methods of forming under bump metallurgy, and constructions comprising solder bumps | — | 2003-07-01 |
| 6551935 | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods | Dinesh Chopra | 2003-04-22 |
| 6511906 | Selective CMP scheme | — | 2003-01-28 |