Issued Patents All Time
Showing 351–375 of 403 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6285038 | Integrated circuitry and DRAM integrated circuitry | — | 2001-09-04 |
| 6274486 | Metal contact and process | Sanh D. Tang | 2001-08-14 |
| 6274928 | Single deposition layer metal dynamic random access memory | Stephen L. Casper, Timothy J. Allen, Mark Durcan, Brian M. Shirley | 2001-08-14 |
| 6232626 | Trench photosensor for a CMOS imager | — | 2001-05-15 |
| 6214707 | Method of forming a doped region in a semiconductor substrate | Randhir P. S. Thakur | 2001-04-10 |
| 6211545 | Device fabricated by a method of controlling outdiffusion from a doped three-dimensional film | Fernando Gonzalez, D. Mark Durcan, Luan C. Tran, Robert Kerr, David F. Cheffings | 2001-04-03 |
| 6204524 | CMOS imager with storage capacitor | — | 2001-03-20 |
| 6177333 | Method for making a trench isolation for semiconductor devices | — | 2001-01-23 |
| 6159790 | Method of controlling outdiffusion in doped three-dimensional film by using angled implants | Fernando Gonzalez, D. Mark Durcan, Luan C. Tran, Robert Kerr, David F. Cheffings | 2000-12-12 |
| 6140630 | Vcc pump for CMOS imagers | — | 2000-10-31 |
| 6130137 | Method of forming a resistor and integrated circuitry having a resistor construction | Kirk D. Prall, Pierre C. Fazan, Aftab Ahmad, Werner Juengling, Pai-Hung Pan +1 more | 2000-10-10 |
| 6110789 | Contact formation using two anneal steps | Philip J. Ireland, Kenneth N. Hagen, Zhiqiang Wu | 2000-08-29 |
| 6083358 | Multiple species sputtering for improved bottom coverage and improved sputter rate | P. J. Ireland, Sujit Sharan, Sukesh Sandhu, Tim O'Brien, Tim Johnson | 2000-07-04 |
| 6013566 | Method of forming a doped region in a semiconductor substrate | Randhir P. S. Thakur | 2000-01-11 |
| 5994182 | Method of reducing outdiffusion from a doped three-dimensional polysilicon film into substrate by using angled implants | Fernando Gonzalez, D. Mark Durcan, Luan C. Tran, Robert Kerr, David F. Cheffings | 1999-11-30 |
| 5990021 | Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufacture | Kirk D. Prall, Sujit Sharan, Gurtel Sandhu, Philip J. Ireland | 1999-11-23 |
| 5960314 | Semiconductor processing method of providing an electrically conductive interconnecting plug between an elevationally conductive node and an elevationally outer electrically conductive node | Timothy P. O'Brien, Rod C. Langley | 1999-09-28 |
| 5940712 | Method of forming a resistor and integrated circuitry having a resistor construction | Kirk D. Prall, Pierre C. Fazan, Aftab Ahmad, Werner Juengling, Pai-Hung Pan +1 more | 1999-08-17 |
| 5933760 | Method and apparatus for reducing fixed charge in semiconductor device layers | Ravi Iyer, Randhir P. S. Thakur | 1999-08-03 |
| 5923078 | Method of forming a resistor and integrated circuitry having a resistor construction | Kirk D. Prall, Pierre C. Fazan, Aftab Ahmad, Werner Juengling, Pai-Hung Pan +1 more | 1999-07-13 |
| 5907166 | Single deposition layer metal dynamic random access memory | Stephen L. Casper, Timothy J. Allen, D. Mark Durcan, Brian M. Shirley | 1999-05-25 |
| 5827770 | Method of making a semiconductor device having improved contacts to a thin conductive layer | Luan C. Tran | 1998-10-27 |
| 5821150 | Method of forming a resistor and integrated circuitry having a resistor construction | Kirk D. Prall, Pierre C. Fazan, Aftab Ahmad, Werner Juengling, Pai-Hung Pan +1 more | 1998-10-13 |
| 5817573 | Semiconductor processing method of providing an electrically conductive interconnecting plug between an elevationally inner electrically conductive node and an elevationally outer electrically conductive node | Timothy P. O'Brien, Rod C. Langley | 1998-10-06 |
| 5780920 | Method of forming a resistor and integrated circuitry having a resistor construction | Kirk D. Prall, Pierre C. Fazan, Aftab Ahmad, Werner Juengling, Pai-Hung Pan +1 more | 1998-07-14 |