Issued Patents All Time
Showing 51–75 of 354 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10608638 | Logic drive using standard commodity programmable logic IC chips | Jin-Yuan Lee | 2020-03-31 |
| 10594322 | Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells | Jin-Yuan Lee | 2020-03-17 |
| 10523210 | Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells | Jin-Yuan Lee | 2019-12-31 |
| 10489544 | Logic drive based on standard commodity FPGA IC chips | Jin-Yuan Lee | 2019-11-26 |
| 10447274 | Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells | Jin-Yuan Lee | 2019-10-15 |
| 9899284 | Chip package and method for fabricating the same | — | 2018-02-20 |
| 9810684 | Method for increasing number of stem cells in human or animal bodies | James Wang, Steve K. Chen, Yun Yen | 2017-11-07 |
| 9612615 | Integrated circuit chip using top post-passivation technology and bottom structure technology | Jin-Yuan Lee, Hsin-Jung Lo, Ping-Jung Yang, Te-Sheng Liu | 2017-04-04 |
| 9391021 | Chip package and method for fabricating the same | — | 2016-07-12 |
| 9153555 | Method of wire bonding over active area of a semiconductor circuit | Jin-Yuan Lee, Ying-Chih Chen | 2015-10-06 |
| 9142527 | Method of wire bonding over active area of a semiconductor circuit | Jin-Yuan Lee, Ying-Chih Chen | 2015-09-22 |
| 9136246 | Integrated chip package structure using silicon substrate and method of manufacturing the same | Jin-Yuan Lee, Ching-Cheng Huang | 2015-09-15 |
| 9030029 | Chip package with die and substrate | Jin-Yuan Lee, Ching-Cheng Huang | 2015-05-12 |
| 9018774 | Chip package | Jin-Yuan Lee, Ching-Cheng Huang | 2015-04-28 |
| 8912666 | Structure and manufacturing method of chip scale package | Jin-Yuan Lee, Ching-Cheng Huang | 2014-12-16 |
| 8901733 | Reliable metal bumps on top of I/O pads after removal of test probe marks | Ching-Cheng Huang, Chuen-Jye Lin, Ming-Ta Lei | 2014-12-02 |
| 8884433 | Circuitry component and method for forming the same | Chien-Kang Chou, Ke-Hung Chen | 2014-11-11 |
| 8853754 | Image and light sensor chip packages | Jin-Yuan Lee | 2014-10-07 |
| 8835221 | Integrated chip package structure using ceramic substrate and method of manufacturing the same | Jin-Yaun Lee, Ching-Cheng Huang | 2014-09-16 |
| 8809951 | Chip packages having dual DMOS devices with power management integrated circuits | Jin-Yuan Lee | 2014-08-19 |
| 8804360 | System-in packages | Jin-Yuan Lee | 2014-08-12 |
| 8749021 | Voltage regulator integrated with semiconductor chip | Gu-Yeon Wei | 2014-06-10 |
| 8748227 | Method of fabricating chip package | Jin-Yuan Lee, Ching-Cheng Huang | 2014-06-10 |
| 8742582 | Solder interconnect on IC chip | — | 2014-06-03 |
| 8742580 | Method of wire bonding over active area of a semiconductor circuit | Jin-Yuan Lee, Ying-Chih Chen | 2014-06-03 |