Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8835221 | Integrated chip package structure using ceramic substrate and method of manufacturing the same | Mou-Shiung Lin, Ching-Cheng Huang | 2014-09-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8835221 | Integrated chip package structure using ceramic substrate and method of manufacturing the same | Mou-Shiung Lin, Ching-Cheng Huang | 2014-09-16 |