Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7829975 | Multichip semiconductor device, chip therefor and method of formation thereof | Nobuo Hayasaka, Katsuya Okumura, Keiichi Sasaki | 2010-11-09 |
| 7808064 | Semiconductor package including through-hole electrode and light-transmitting substrate | Atsuko Kawasaki, Ikuko Inoue, Masayuki Ayabe, Masahiro Sekiguchi, Kazumasa Tanida | 2010-10-05 |
| 7608537 | Method for fabricating semiconductor device | Hisashi Kaneko | 2009-10-27 |
| 7531876 | Semiconductor device having power semiconductor elements | Ichiro Omura, Kenji Takahashi, Chiaki Takubo, Hideo Aoki, Hideo Numata +5 more | 2009-05-12 |
| 7521352 | Method for manufacturing a semiconductor device | Hideo Shinomiya, Jun Hirota, Hisashi Kaneko | 2009-04-21 |
| 7507634 | Method for fabricating a localize SOI in bulk silicon substrate including changing first trenches formed in the substrate into unclosed empty space by applying heat treatment | Tsutomu Sato, Ichiro Mizushima, Yoshitaka Tsunashima, Shinichi Takagi | 2009-03-24 |
| 7482194 | Electronic component having micro-electrical mechanical system | — | 2009-01-27 |
| 7427797 | Semiconductor device having actuator | Tatsuya Ohguro, Tamio Ikehashi, Shuichi Sekine | 2008-09-23 |
| 7402903 | Semiconductor device | — | 2008-07-22 |
| 7335517 | Multichip semiconductor device, chip therefor and method of formation thereof | Nobuo Hayasaka, Katsuya Okumura, Keiichi Sasaki | 2008-02-26 |
| 7238919 | Heating element movement bonding method for semiconductor components | Hisashi Kaneko, Hirokazu Ezawa | 2007-07-03 |
| 7235456 | Method of making empty space in silicon | Tsutomu Sato, Ichiro Mizushima, Yoshitaka Tsunashima, Shinichi Takagi | 2007-06-26 |
| 7177134 | Variable-capacitance element, variable-capacitance device, and portable phone including variable-capacitance device | Tamio Ikehashi, Tatsuya Ohguro | 2007-02-13 |
| 7095112 | Semiconductor device, semiconductor package member, and semiconductor device manufacturing method | Mitsuyoshi Endo, Chiaki Takubo | 2006-08-22 |
| 7067897 | Semiconductor device | Masaaki Hatano, Hiroshi Ikegami, Takamasa Usui | 2006-06-27 |
| 7053456 | Electronic component having micro-electrical mechanical system | — | 2006-05-30 |
| 7019364 | Semiconductor substrate having pillars within a closed empty space | Tsutomu Sato, Ichiro Mizushima, Yoshitaka Tsunashima, Shinichi Takagi | 2006-03-28 |
| 7019398 | Semiconductor device | — | 2006-03-28 |
| 6991964 | Stacked type semiconductor device | Kenichi Imamiya | 2006-01-31 |
| 6933205 | Integrated circuit device and method of manufacturing the same | Nobuo Hayasaka, Noriaki Matsunaga, Katsuya Okumura | 2005-08-23 |
| 6812557 | Stacked type semiconductor device | Takashi Yoda | 2004-11-02 |
| 6809421 | Multichip semiconductor device, chip therefor and method of formation thereof | Nobuo Hayasaka, Katsuya Okumura, Keiichi Sasaki | 2004-10-26 |
| 6791175 | Stacked type semiconductor device | Kenichi Imamiya | 2004-09-14 |
| 6734568 | Semiconductor device and method of manufacturing the same | Masahiro Miyata, Hirokazu Ezawa | 2004-05-11 |
| 6717251 | Stacked type semiconductor device | Nobuo Hayasaka, Tsunetoshi Arikado, Hidemi Ishiuchi, Koji Sakui, Chiaki Takubo | 2004-04-06 |