Issued Patents All Time
Showing 51–58 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6709966 | Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device | Yoshimi Hisatsune, Keiichi Sasaki, Hiroshi Ikegami, Nobuo Hayasaka, Katsuya Okumura | 2004-03-23 |
| 6614106 | Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device | Nobuo Hayasaka | 2003-09-02 |
| 6504227 | Passive semiconductor device mounted as daughter chip on active semiconductor device | Nobuo Hayasaka, Noriaki Matsunaga, Katsuya Okumura | 2003-01-07 |
| 5775980 | Polishing method and polishing apparatus | Yasutaka Sasaki, Rempei Nakata, Junichi Wada, Nobuo Hayasaka, Hiroyuki Yano +1 more | 1998-07-07 |
| 5731634 | Semiconductor device having a metal film formed in a groove in an insulating film | Haruo Okano, Nobuo Hayasaka, Kyoichi Suguro, Hideshi Miyajima, Jun Wada | 1998-03-24 |
| 5607718 | Polishing method and polishing apparatus | Yasutaka Sasaki, Rempei Nakata, Junichi Wada, Nobuo Hayasaka, Hiroyuki Yano +1 more | 1997-03-04 |
| 5561082 | Method for forming an electrode and/or wiring layer by reducing copper oxide or silver oxide | Haruo Okano, Nobuo Hayasaka, Kyoichi Suguro, Hideshi Miyajima, Jun Wada | 1996-10-01 |
| 5424246 | Method of manufacturing semiconductor metal wiring layer by reduction of metal oxide | Haruo Okano, Nobuo Hayasaka, Kyoichi Suguro, Hideshi Miyajima, Jun Wada | 1995-06-13 |