Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12253955 | Methods, systems, articles of manufacture and apparatus to control address space isolation in a virtual machine | Jun Tian, Kun Tian | 2025-03-18 |
| 11971827 | Methods, systems, articles of manufacture and apparatus to control address space isolation in a virtual machine | Jun Tian, Kun Tian | 2024-04-30 |
| 11960422 | Direct memory access tracking for pass-through devices in virtualized environments | Kun Tian, Yan Zhao | 2024-04-16 |
| 11901280 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Kemal Aygun | 2024-02-13 |
| 11742275 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Kemal Aygun | 2023-08-29 |
| 11598804 | Debug tool for test instruments coupled to a device under test | Jesse Armagost, Nathan S. Blackwell, Matthew Boelter, Geoffrey Oliver Kelly, James Neeb +2 more | 2023-03-07 |
| 11244890 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Kemal Aygun | 2022-02-08 |
| 11031341 | Side mounted interconnect bridges | Md Altai Hossain, Kevin J. Doran, Zhiguo Qian | 2021-06-08 |
| 10886171 | Rlink-on-die interconnect features to enable signaling | Kemal Aygun | 2021-01-05 |
| 10854539 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Kemal Aygun | 2020-12-01 |
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more | 2020-09-22 |
| 10778600 | Adaptive workload distribution for network of video processors | Huifeng Le, Wenjian SHAO, Shao-Wen Yang, Heng Juen Han, Xiaowen Zhang | 2020-09-15 |
| 10607951 | Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices | Gabriel Regalado Silva, Zhiguo Qian, Kemal Aygun | 2020-03-31 |
| 10580734 | Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices | Gabriel Regalado Silva, Zhiguo Qian, Kemal Aygun | 2020-03-03 |
| 10453795 | Microprocessor package with first level die bump ground webbing structure | Mathew J. Manusharow, Kemal Aygun, Mohiuddin M. Mazumder | 2019-10-22 |
| 10396022 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Kemal Aygun | 2019-08-27 |
| 10396036 | Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices | Zhiguo Qian, Kemal Aygun, Yidnekachew S. Mekonnen, Gregorio R. Murtagian, Sanka Ganesan +2 more | 2019-08-27 |
| 10026682 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Kemal Aygun | 2018-07-17 |
| 9935063 | Rlink-on-die inductor structures to improve signaling | Jihwan Kim, Ajay Balankutty, Anupriya Sriramulu, Md. Mohiuddin Mazumder, Frank O'Mahony +2 more | 2018-04-03 |
| 9515017 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Kemal Aygun | 2016-12-06 |
| 9230900 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Kemal Aygun | 2016-01-05 |