Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735549 | Methods and systems for manufacturing pillar structures on semiconductor devices | Suresh Yeruva, Owen R. Fay, Sameer S. Vadhavkar, Adriel Jebin Jacob Jebaraj | 2023-08-22 |
| 11631630 | Pillar-last methods for forming semiconductor devices | Anilkumar Chandolu, Sameer S. Vadhavkar | 2023-04-18 |
| 11239129 | Package cooling by coil cavity | Andrew M. Bayless, Owen R. Fay | 2022-02-01 |
| 11139159 | Methods of removing particles from over semiconductor substrates | Joseph Neil Greeley, Dan B. Millward | 2021-10-05 |
| 11081460 | Methods and systems for manufacturing pillar structures on semiconductor devices | Suresh Yeruva, Owen R. Fay, Sameer S. Vadhavkar, Adriel Jebin Jacob Jebaraj | 2021-08-03 |
| 10957625 | Pillar-last methods for forming semiconductor devices | Anilkumar Chandolu, Sameer S. Vadhavkar | 2021-03-23 |
| 10886244 | Collars for under-bump metal structures and associated systems and methods | Giorgio Mariottini, Sameer S. Vadhavkar, Anilkumar Chandolu, Mark Bossier | 2021-01-05 |
| 10763186 | Package cooling by coil cavity | Andrew M. Bayless, Owen R. Fay | 2020-09-01 |
| 10692733 | Uniform back side exposure of through-silicon vias | Jaspreet S. Gandhi | 2020-06-23 |
| 10410879 | Uniform back side exposure of through-silicon vias | Jaspreet S. Gandhi | 2019-09-10 |
| 10262922 | Semiconductor device having through-silicon-via and methods of forming the same | Jaspreet S. Gandhi | 2019-04-16 |
| 10137481 | Methods of removing particles from over semiconductor substrates | Joseph Neil Greeley, Dan B. Millward | 2018-11-27 |
| 9941190 | Semiconductor device having through-silicon-via and methods of forming the same | Jaspreet S. Gandhi | 2018-04-10 |
| 9837383 | Interconnect structure with improved conductive properties and associated systems and methods | Jaspreet S. Gandhi, James M. Derderian | 2017-12-05 |
| 9818622 | Uniform back side exposure of through-silicon vias | Jaspreet S. Gandhi | 2017-11-14 |
| 9780052 | Collars for under-bump metal structures and associated systems and methods | Giorgio Mariottini, Sameer S. Vadhavkar, Anilkumar Chandolu, Mark Bossler | 2017-10-03 |
| 9412675 | Interconnect structure with improved conductive properties and associated systems and methods | Jaspreet S. Gandhi, James M. Derderian | 2016-08-09 |
| 9397078 | Semiconductor device assembly with underfill containment cavity | Anilkumar Chandolu, Sameer S. Vadhavkar | 2016-07-19 |
| 9153451 | Method of forming a planar surface for a semiconductor device structure, and related methods of forming a semiconductor device structure | Andrew Carswell, Siddartha Kondoju, Jin Lu, Suresh Ramakrishnan, Kozaburo Sakai +2 more | 2015-10-06 |
| 8974655 | Methods of planarization and electro-chemical mechanical polishing processes | Whonchee Lee | 2015-03-10 |
| 8956974 | Devices, systems, and methods related to planarizing semiconductor devices after forming openings | Anurag Jindal | 2015-02-17 |
| 8940102 | Methods of removing particles from over semiconductor substrates | Neil Greeley, Dan B. Millward | 2015-01-27 |
| 8809157 | Methods of forming a programmable region that comprises a multivalent metal oxide portion and an oxygen containing dielectric portion | D. V. Nirmal Ramaswamy, Beth R. Cook, Lei Bi, Ian C. Laboriante | 2014-08-19 |
| 8633084 | Methods of forming a memory cell having programmable material that comprises a multivalent metal oxide portion and an oxygen containing dielectric portion | D. V. Nirmal Ramaswamy, Beth R. Cook, Lei Bi, Ian C. Laboriante | 2014-01-21 |
| 8226772 | Methods of removing particles from over semiconductor substrates | Neil Greeley, Dan B. Millward | 2012-07-24 |