Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272671 | Semiconductor device package and method for manufacturing the same | Chih-Ming Hung, Meng-Jen Wang, Jen-Kai Ou | 2025-04-08 |
| 12009353 | Optical device package with compatible lid and carrier | Meng-Jen Wang, Yu-Fang Tsai, Meng-Jung Chuang | 2024-06-11 |
| 11776889 | Semiconductor package device and method of manufacturing the same | Chih-Hsin Chang, Tsu-Hsiu Wu | 2023-10-03 |
| 11764311 | Optical device and electronic device | Yu-Pin Tsai, Teck-Chong Lee | 2023-09-19 |
| 11682653 | Semiconductor device package and method for manufacturing the same | Chih-Ming Hung, Meng-Jen Wang, Jen-Kai Ou | 2023-06-20 |
| 11302682 | Optical device package | Meng-Jen Wang, Yu-Fang Tsai, Meng-Jung Chuang | 2022-04-12 |
| 11133423 | Optical device and method of manufacturing the same | Yu-Pin Tsai, Teck-Chong Lee | 2021-09-28 |
| 11024570 | Semiconductor package device and method of manufacturing the same | Chih-Hsin Chang, Tsu-Hsiu Wu | 2021-06-01 |
| 10937761 | Semiconductor device package and method for manufacturing the same | Chih-Ming Hung, Meng-Jen Wang, Jen-Kai Ou | 2021-03-02 |
| 10545581 | Semiconductor package device | Jen-Kai Ou, Meng-Jen Wang, Chih-Ming Hung | 2020-01-28 |
| 10522505 | Semiconductor device package and method for manufacturing the same | Chih-Ming Hung, Meng-Jen Wang, Jen-Kai Ou | 2019-12-31 |
| 10242940 | Fan-out ball grid array package structure and process for manufacturing the same | Jung-Liang YEH, Meng-Jen Wang, Chih-Ming Hung | 2019-03-26 |
| 10147835 | Optical device and method of manufacturing the same | Po-Nien Chen, Yu-Ting Chien, Yueh-Lung Lin | 2018-12-04 |
| 9618191 | Light emitting package and LED bulb | Hsiao-Chuan Chang | 2017-04-11 |
| 8592982 | Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof | Yi-Shao Lai, Ming-Kun Chen, Tai-Ping Wang, Ming-Hsiang Cheng | 2013-11-26 |
| 8421242 | Semiconductor package | Hsiao-Chuan Chang, Yi-Shao Lai, Chang-Lin Yeh, Ming-Hsiang Cheng | 2013-04-16 |
| 8368216 | Semiconductor package | Yi-Shao Lai, Ming-Kun Chen, Hsiao-Chuan Chang, Ming-Hsiang Cheng | 2013-02-05 |
| 8274149 | Semiconductor device package having a buffer structure and method of fabricating the same | Hsiao-Chuan Chang, Yi-Shao Lai, Ming-Hsiang Cheng | 2012-09-25 |
| 8253431 | Apparatus and method for testing non-contact pads of a semiconductor device to be tested | Yi-Shao Lai, Ming-Kun Chen, I. L. Lin, Ken Juang, Ming-Hsiang Cheng | 2012-08-28 |
| 8222733 | Semiconductor device package | Ming-Hsiang Cheng, Yi-Shao Lai, Hsiao-Chuan Chang | 2012-07-17 |
| 8222726 | Semiconductor device package having a jumper chip and method of fabricating the same | Hsiao-Chuan Chang, Yi-Shao Lai, Jiunn Chen, Ming-Hsiang Cheng | 2012-07-17 |
| 8115285 | Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof | Chien-Wen Chen, Yi-Shao Lai, Hsiao-Chuan Chang, Pao-Huei Chang Chien, Ping Hu +1 more | 2012-02-14 |
| 8110931 | Wafer and semiconductor package | Hsiao-Chuan Chang, Yi-Shao Lai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +6 more | 2012-02-07 |
| 8076786 | Semiconductor package and method for packaging a semiconductor package | Chang Ying Hung, Hsiao-Chuan Chang, Yi-Shao Lai, Jian-Cheng Chen, Wei Chi Yih +1 more | 2011-12-13 |
| 8072064 | Semiconductor package and method for making the same | Yi-Shao Lai, Ming-Kun Chen, Hsiao-Chuan Chang, Ming-Hsiang Cheng | 2011-12-06 |