Issued Patents All Time
Showing 1–25 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412864 | Bonding wire for semiconductor devices | Daizo Oda, Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tetsuya OYAMADA | 2025-09-09 |
| 12388044 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO +2 more | 2025-08-12 |
| 12334467 | Copper bonding wire | Tetsuya OYAMADA, Daizo Oda, Kota Shimomura, Tadashi Yamaguchi | 2025-06-17 |
| 12325901 | AI wiring material | Yuto KURIHARA, Ryo OISHI, Motoki ETO, Daizo Oda, Tetsuya OYAMADA +1 more | 2025-06-10 |
| 12300658 | Copper alloy bonding wire for semiconductor devices | Daizo Oda, Takashi Yamada, Motoki ETO, Teruo Haibara | 2025-05-13 |
| 12299305 | Information processing device and non-transitory computer-readable storage medium | Shota Yamashita, Tomonori Furuta | 2025-05-13 |
| 12166006 | Bonding wire for semiconductor devices | Tetsuya OYAMADA, Daizo Oda, Motoki ETO | 2024-12-10 |
| 12132025 | Bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO +2 more | 2024-10-29 |
| 12090578 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO +2 more | 2024-09-17 |
| 11722097 | Integrated circuit device and oscillator | — | 2023-08-08 |
| 11612966 | Ag alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Daizo Oda, Motoki ETO, Takumi Ohkabe | 2023-03-28 |
| 11429286 | Information processing apparatus and recording medium storing information processing program | Tomonori Furuta | 2022-08-30 |
| 11373934 | Bonding wire for semiconductor device | Daizo Oda, Takashi Yamada, Motoki ETO, Teruo Haibara | 2022-06-28 |
| 11372576 | Data processing apparatus, non-transitory computer-readable storage medium, and data processing method | Tomonori Furuta | 2022-06-28 |
| 11342299 | Bonding wire for semiconductor devices | Daizo Oda, Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tetsuya OYAMADA | 2022-05-24 |
| 11217532 | Three-dimensional memory device containing compositionally graded word line diffusion barrier layer for and methods of forming the same | Rahul Sharangpani, Raghuveer S. Makala, Fei Zhou, Adarsh Rajashekhar, Tatsuya Hinoue +2 more | 2022-01-04 |
| 11063557 | Oscillation circuit, oscillator, electronic apparatus, and vehicle | — | 2021-07-13 |
| 11038460 | Circuit apparatus, oscillator, electronic instrument, and vehicle | Katsuhito Nakajima | 2021-06-15 |
| 10991672 | Cu alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Takashi Yamada, Daizo Oda | 2021-04-27 |
| 10985130 | Cu alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Takashi Yamada, Daizo Oda | 2021-04-20 |
| 10978988 | Selective emitter for thermophotovoltaic power generator | Shinji Tokumaru | 2021-04-13 |
| 10950571 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Takashi Yamada, Daizo Oda, Motoki ETO | 2021-03-16 |
| 10950570 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Hiroyuki Deai | 2021-03-16 |
| 10889899 | Ceramic laminate, ceramic insulating substrate, and method for manufacturing ceramic laminate | Keiichi Kimura, Keisuke TOKUHASHI, Yutaka Sato | 2021-01-12 |
| 10889900 | Ceramic laminate | Keisuke TOKUHASHI, Keiichi Kimura, Yutaka Sato | 2021-01-12 |